[1] DOBROVINSKAYA E R, LYTVYNOV L A, PISHCHIK V. Sapphire: Material, Manufacturing, Applications ［M］. US: Springer, 2009: 42-45.
[2] HANEY E J, SUBHASH G. Static and dynamic indentation response of basal and prism plane sapphire ［J］.Journal of the European Ceramic Society, 2011, 31(9): 1713-1721.
[3] DOBROVINSKAYA E R. Sapphire: Material, Manufacturing, Applications ［M］. ZHANG M F, Trans.Beijing: Science Press, 2013.(in Chinese)
[4] ZHOU P. Study on Ducile Lapping of Crystal Sapphire Wafer ［D］. Hangzhou: Zhejiang University of Technology, 2010. (in Chinese)
[5] KE R, ZHANG Y M, CHEN Z Y.Study on creep properties of sapphire single crystal ［J］.Journal of artificial crystal, 2014, 43(3): 487-491.(in Chinese)
[7] HUANG L, BONIFACIO C, SONG D, et al.. Investigation into the microstructure evolution caused by nanoscratch-induced room temperature deformation in M-plane sapphire ［J］.Acta Materialia, 2011, 59(13): 5181-5193.
[8] ZHANG C L, FENG P F, ZHANG J F. Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter ［J］. International Journal of Machine Tools and Manufacture, 2013, 64: 38-48.
[9] BAFAKEEH O T, KHOSHAIM A B, MARINESCU I D. ELID fine grinding of sapphire rollers with emphasis on roughness and material removal rate ［J］. Procedia Manufacturing, 2016, 5: 1249-1264.
[10] LIANG Z Q, WANG X B, WU Y B, et al.. An investigation on wear mechanism of resin-bonded diamond wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire ［J］.Journal of Materials Processing Technology, 2012, 212(4): 868-876.
[11] LIANG Z Q, WANG X B, WU Y B, et al.. Experimental study on brittle-ductile transition in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain ［J］.International Journal of Machine Tools and Manufacture, 2013, 71: 41-51.
[12] LIANG C. Research on parameter optimization of large size sapphire machining process and experimental ［D］.Harbin: Harbin University of Science and Technology, 2013.(in Chinese)
[13] SHEN F.The effect of anisotropy on the precision lapping of single crystal sapphire ［J］.Science and technology information, 2010(24): 142, 145.(in Chinese)
[14] ZHU H L, TESSAROTO L A, SABIA R, et al.. Chemical mechanical polishing (CMP) anisotropy in sapphire ［J］.Applied Surface Science, 2004, 236(1-4): 120-130.
[15] LIU Z. Experimental studies on ultrasonic vibration and electrolytic in-process dressing (ELID) ［D］.Jiaozuo: Henan Polytechnic University, 2014.(in Chinese)
[16] ZHOU X Y. The experimental research on grinding of ultra-fine grain cemented carbide ［D］.Changsha: Hunan University, 2013.(in Chinese)
[17] ZHANG D K, LI C H, JIA D Z, et al.. Specific grinding energy and surface roughness of nanoparticle jet minimum quantity lubrication in grinding ［J］.Chinese Journal of Aeronautics, 2015, 28(2): 570-581.
[18] CHENG M. The research on super high speed grinding technology in YG8 and PA30 cemented carbide ［D］. Changsha: Hunan University, 2011.(in Chinese)
[19] LIU W X, ZHOU Z Y.Research on grinding force of nanostructure ceramic coatings ［J］.Machine Building & Automation, 2012, 41(1): 71-72.(in Chinese)
[20] LI N X. Research on properties of HVOF sprayed WC-Co coatings ［D］.Dalian: Dalian Maritime University, 2010.(in Chinese)
