• Acta Photonica Sinica
  • Vol. 50, Issue 10, 1004002 (2021)
Jun ZHENG1、2、*, Xiangquan LIU1、2, Mingming LI1、2, Zhi LIU1、2, Yuhua ZUO1、2, Chunlai XUE1、2, and Buwen CHENG1、2
Author Affiliations
  • 1State Key Laboratory on Integrated Optoelectronics,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China
  • 2Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China
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    DOI: 10.3788/gzxb20215010.1004002 Cite this Article
    Jun ZHENG, Xiangquan LIU, Mingming LI, Zhi LIU, Yuhua ZUO, Chunlai XUE, Buwen CHENG. Research Progress on the Growth of Novel Silicon-based IV Group Alloy Materials and Optoelectronic Devices(Invited)[J]. Acta Photonica Sinica, 2021, 50(10): 1004002 Copy Citation Text show less

    Abstract

    The bandgap of silicon-based germanium tin and germanium lead alloys can be adjusted with the composition, and can be transformed into a direct bandgap semiconductor material. It is an ideal material for developing silicon-based infrared luminescence and detector. This work first introduces the growth of germanium tin and germanium lead alloys, and then reviews the research progress of germanium tin optoelectronic devices. The germanium tin photodetector has developed towards high responsivity and long cut-off wavelength with increasing tin content. The research of germanium tin lasers is focused on low lasing threshold, high lasing temperature and electric pumping. In addition, this work also briefly introduces the research on germanium lead material and optoelectronic devices. With the development of silicon-based high-efficiency light sources and detectors, group IV alloys will continue to show important application value in the field of silicon-based infrared optoelectronic integration.
    Jun ZHENG, Xiangquan LIU, Mingming LI, Zhi LIU, Yuhua ZUO, Chunlai XUE, Buwen CHENG. Research Progress on the Growth of Novel Silicon-based IV Group Alloy Materials and Optoelectronic Devices(Invited)[J]. Acta Photonica Sinica, 2021, 50(10): 1004002
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