Author Affiliations
1Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Shanghai 201800, China2University of Chinese Academy of Sciences, Beijing 100049, China3Shanghai Advanced Research Institute, Chinese Academy of Sciences, Shanghai 201204, Chinashow less
Fig. 1. Model of SHINE SCU prototype 1-Flange, 2-Binary current leads, 3-Copper neck, 4-Vacuum chamber, 5-Thermal shield, 6-Magnet, 7-Magnet support rods, 8-Support platform
Fig. 2. Schematic diagram of cooling design for binary current lead1-Normal conductive copper lead, 2-Connecting block, 3-HTS, 4-Superconducting wire, 5-Cooling tube (45 K), 6-AlN block, 7-Copper neck, 8-Thermal conduction copper block, 9-Thermal conduction belt, 10-Magnets fixture (4.2 K), 11-Magnet
Fig. 3. Cooling structure of current lead(a) Structure of thermal conduction assembly, (b) HTS connecting, (c) Copper leads connecting
Fig. 4. Variation curve of thermal conductivity and resistivity of copper (RRR=80)
Fig. 5. Simulation boundary conditions for cooling structure of current lead
Fig. 6. Heat load of copper leads with different diameter
Fig. 7. Temperature distribution of cooling structure of current leads (a) With no current, (b) With full current
Fig. 8. Electric connection of HTS cold end in the cryostat test
Fig. 9. Cooling and powering test for current leads
Fig. 10. Layout of 10 current leads on the copper neck in test
Fig. 11. Temperature curves of HTS hot end during cooling down (a), average temperature comparison of HTS hot end, cooling tube entrance and copper neck (b)
Fig. 12. Temperature curves of HTS hot end during powering up (a), comparison of average temperature of HTS hot end, temperature in cooling tube entrance, and temperature in copper neck (b)
温度Temperature t / K | 45 |
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压强Pressure p / MPa | 0.4 | 流量Flow Rate q / kg·s-1 | 0.02 | 密度Density / kg·m-3 | 4.3 | 比热容Specific Heat Capacity Cp / J·kg-1·K-1 | 5 233 | 导热系数Thermal Conductivity λ / W·m-1·K-1 | 0.044 | 动力粘滞系数Viscosity / Pa·s-1 | 6×10-6 |
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Table 1. Main parameters of low-temperature helium gas
状态 Condition | 冷却结构主要温度 Average temperature of cooling structure / K |
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HTS热端 HTS hot end | 铜脖 Copper neck |
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无电流 No current | 50.9 | 50.2 | 满电流 Full current | 52.7 | 51.8 |
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Table 2. Main simulated temperature of cooling structure of current leads