Xin WANG, Feng GONG, Chifai CHEUNG, Gao YANG. Fabrication and optimization of high-temperature uniform rapid heating module for glass hot embossing[J]. Optics and Precision Engineering, 2023, 31(15): 2203
- Optics and Precision Engineering
- Vol. 31, Issue 15, 2203 (2023)
Fig. 1. Measurement setup for surface temperature of ceramic heater
Fig. 2. Temperature histories of various points on surface of ceramic heater
Fig. 3. Geometric model of heating module
Fig. 4. Experimental devices of Si3N4 ceramic heater
Fig. 5. Structure of even-heat block
Fig. 6. Analysis of heat transfer in heating stage
Fig. 7. Verification of repeatability of temperature measurement
Fig. 8. Temperature histories of measurement points from P1 to P12 in 180-second constant voltage heating test
Fig. 9. Thermophysical properties of copper
Fig. 10. Mesh of heating module
Fig. 11. Temperature distribution on upper surface of even-heat block under constant-voltage heating for 180 s
Fig. 12. Comparison of simulation and constant-voltage heating experimental results
Fig. 13. Comparison of simulation and experimental results when heating for 180 s
Fig. 14. Geometric meaning of factors
Fig. 15. Influence of various factors on heating rate
Fig. 16. Influence of various factors on temperature uniformity
Fig. 17. Optimized structure of even-heat block
Fig. 18. Temperature histories of measurement points from P1 to P12 in 180-second constant voltage heating test
Fig. 19. Comparison of temperature uniformity before and after optimization
Fig. 20. Heating to 700 ℃ under control
Fig. 21. Hot embossing machine
Fig. 22. Surface topography of silicon carbide mold and glass microstructure arrays
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Table 1. Thermophysical parameters of each material of heating module
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Table 2. Factors and their levels
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Table 3. Orthogonal test results
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Table 4. Analysis of results
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