[1] ZAHNG Xiao-bing. Review on processing and testing technology of aspheric optical elements[J]. Weapon Materials Science and Engineerin, 2014, 37(2): 106-111.
[2] ZHU Yong-wei, LI Xin-lu, WANG Zhan-kui, et al. Subsurface prediction in abrasive grinding of optical hard and brittle materials[J]. Optical Precision Engineering, 2017, 25(2): 368-374 .
[3] SHIMADA K, OKA H. Magnetic characteristics of magnetic compound fluid (MCF) under DC and AC magnetic fields[J]. Journal of Magnetism and Magnetic Materials, 2005, 290(2): 804-807.
[4] WU Yong-bo, WANG You-liang, MASAKAZU F, et al. Nano-precision polishing of CVD SiC using MCF(Magnetic Compound Fluid) slurry [J]. Journal of the Korean Society of Manufacturing Technology Engineers, 2014, 23(6): 547-554.
[5] GUO Hui-ru, WU Yong-bo, LU Dong, et al. Ultrafine polishing of electroless nickel-phosphorus-plated mold with magnetic compound fluid slurry[J]. Materials and Manufacturing Processes, 2014, 29(6): 1502-1509.
[6] CHEN Feng-jun, YIN Yun-hui, YU Jian-wu,et al. Research progress of magnetorheological finishing technology [J]. China Mechanical Engineering, 2011, 22(19): 2382-2392.
[7] GUO Hui-ru, WU Yong-bo, LU Dong, et al. Effects of pressure and shear stress on material removal rate in ultra-fine polishing of optical glass with magnetic compound fluid slurry [J]. Journal of Material Processing Technology, 2014, 214(11): 2759-2769.
[8] WANG Hui-jun, ZHANG Fei-hu, ZHAO Hang, et al. Effect of several technological parameters on material removal rate in ultrasonic magnetorheological composite polishing[J]. Optical Precision Engineering, 2007, 15(10) 1584-1587.
[9] SHIMADA K, AKAGAMI Y, FUJITA T. Characteristics of magnetic compound fluid (MCF) in a rotating rheometer[J]. Journal of Magnetism and Magnetic Materials, 2002, 252(10): 235-237.
[10] SHIMADA K, WU Yong-bo, WANG You-liang. Effect of magnetic cluster and magnetic field on polishing using magnetic compound filud(MCF)[J]. Journal of Magnetism and Magnetic Materials, 2003, 262(2): 242-247.
[11] WU Yuan-yuan, YI Shou-zhi, WI Zhi-jie, et al. Study on suspension and redispersity of Ceric oxide polishing liquid[J]. Chinese Powder Technology, 2015, 21(2): 57-60.
[13] LI Qing-zhong, SHI Wei-bing, XIA Ming-guang. Study on fine atomization and removal mechanism of zinc selenide crystal[J]. Surface Technology, 2017,47(6): 271-276.
[14] XU Xue-feng, MA Bing-xun, HU Jian-de, et al. Study on chemical mechanical polishing technology without polishing pad[J]. China Mechanical Engineering, 2008, 19(20): 2407-2410.
[15] WANG Jin-pu, BAI Lin-shan, CHU Xiang-feng, et al. Study on chemical and mechanical polishing of hard disk glass-ceramics substrate[J]. Journal of Intraocular Crystals, 2015,44(1): 216-220.
[16] BAI Ya-wen, CHEN Guo-mei, TENG Kang, et al. Effect of cationic surfactant on the chemical and mechanical polishing efficiency of a sapphire wafer[J]. Journal of Intraocular Crystals, 2018, 47(3): 470-475.
[17] YAO Wei-qiang, MA Guo-wei, JIN Qing-bo, et al. Study on polishing performance of electrostatic layer self-assembled composite abrasive and polishing liquid[J]. China Mechanical Engineering, 2013,24(6): 742-746.
[18] LI Jun, HUANG Jian-dong, XIA Lei, et al. Effect of chemical additive on fixed abrasive pad self-conditioning in CMP [J]. International Journal of Advanced Manufacturin Technology, 2017, 88(1-4): 107-113.