• Optics and Precision Engineering
  • Vol. 30, Issue 12, 1452 (2022)
Chen JIANG*, Jian LIU, Jiuxiang WEI, and Jianfei LAN
Author Affiliations
  • College of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai200093, China
  • show less
    DOI: 10.37188/OPE.20223012.1452 Cite this Article
    Chen JIANG, Jian LIU, Jiuxiang WEI, Jianfei LAN. Design and process test of h-shaped magnetic composite fluid polishing tool[J]. Optics and Precision Engineering, 2022, 30(12): 1452 Copy Citation Text show less
    MCF deep hole polishing principle
    Fig. 1. MCF deep hole polishing principle
    Four different methods of magnetizing magnets
    Fig. 2. Four different methods of magnetizing magnets
    Distribution of the magnetic field mode on the inner wall of the hole under different magnetization methods
    Fig. 3. Distribution of the magnetic field mode on the inner wall of the hole under different magnetization methods
    Magnetic field model
    Fig. 4. Magnetic field model
    Distribution of the magnetic field mode on the inner wall of the hole under different magnet spacings
    Fig. 5. Distribution of the magnetic field mode on the inner wall of the hole under different magnet spacings
    Effect of magnet spacing on magnetic field mode
    Fig. 6. Effect of magnet spacing on magnetic field mode
    Velocity field distribution of hole inner wall under
    Fig. 7. Velocity field distribution of hole inner wall under
    Effect of polishing speed on shear rate and pressure
    Fig. 8. Effect of polishing speed on shear rate and pressure
    Effect of polishing gap on shear rate and pressure
    Fig. 9. Effect of polishing gap on shear rate and pressure
    MCF polishing tool head test device
    Fig. 10. MCF polishing tool head test device
    Effect of different polishing methods on surface
    Fig. 11. Effect of different polishing methods on surface
    Effect of polishing time on surface morphology
    Fig. 12. Effect of polishing time on surface morphology
    Surface roughness and material removal rate under different polishing parameters
    Fig. 13. Surface roughness and material removal rate under different polishing parameters
    成分粒径质量比
    氧化铝(Al2O30.5 μm14%
    羰基铁粉300目52%
    去离子水31%
    α-纤维素3%
    Table 1. Composition ratio of MCF
    工艺参数数值
    氧化铝磨粒粒径N/μm0.5,1.0,2.5,5
    时间t/min5,10,15,20,25,30
    抛光转速v/(r·min-11000,1200,1400,1600,1800,2000
    抛光间隙θ/mm0.5,0.75,1,1.25,1.5,1.75
    磁铁间距d/mm3,5,8,10,13
    Table 2. Polishing process parameters of MCF
    Chen JIANG, Jian LIU, Jiuxiang WEI, Jianfei LAN. Design and process test of h-shaped magnetic composite fluid polishing tool[J]. Optics and Precision Engineering, 2022, 30(12): 1452
    Download Citation