Finite element simulation on packaging of hinged high-g micromachined accelerometer

[in Chinese]; [in Chinese]; [in Chinese]

Journals >Optics and Precision Engineering >Volume 15 >Issue 2 >Page 199 > Article

Optics and Precision Engineering
Vol. 15, Issue 2, 199 (2007)

Finite element simulation on packaging of hinged high-g micromachined accelerometer

¹, ^1,2, and ²

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¹[in Chinese]

²[in Chinese]

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[in Chinese], [in Chinese], [in Chinese]. Finite element simulation on packaging of hinged high-g micromachined accelerometer[J]. Optics and Precision Engineering, 2007, 15(2): 199 Copy Citation Text

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References

[3] TANNER D M,WALRAVEN J A,HELGESEN K,et al..MEMS reliability in shock environments[C].IEEE International Reliability Physics Symposium,2000,Piscataway:129-138.

[4] DAVIES B R,BARRON C C,MONTAGUE S,et al..High g MEMS integrated accelerometer[J].SPIE,1997,3046:52-62.

[6] HUANG W D,CAI X,XU B L,et al..Packaging effects on the performance of MEMS for high-g accelerometer with double-cantilevers[J].Sensor Actuator A,2003,102 (3):268-278.

[8] WALTER P L.Trends in accelerometer design for military and aerospace application[J].Sensors Magazine,1999,16(3):21-25.

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[in Chinese], [in Chinese], [in Chinese]. Finite element simulation on packaging of hinged high-g micromachined accelerometer[J]. Optics and Precision Engineering, 2007, 15(2): 199

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