• Chinese Journal of Lasers
  • Vol. 38, Issue 6, 603002 (2011)
Ji Lingfei*, Yan Yinzhou, Bao Yong, Chen Xiaochuan, and Jiang Yijian
Author Affiliations
  • [in Chinese]
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    DOI: 10.3788/cjl201138.0603002 Cite this Article Set citation alerts
    Ji Lingfei, Yan Yinzhou, Bao Yong, Chen Xiaochuan, Jiang Yijian. Research on Laser Close-Piercing Lapping Processing for Damage-Free Cutting of Thick Al2O3 Ceramics[J]. Chinese Journal of Lasers, 2011, 38(6): 603002 Copy Citation Text show less

    Abstract

    Achievement of laser close-piercing lapping processing technique for damage-free cutting in arbitrary path (line, curve and angle) of dense Al2O3 ceramics with the thickness of 10~12 mm by CO2 laser is proposed. By the combination analysis of scan electron microscope (SEM) and laser scanning confocal microscope on the cut surface, the good cut quality is concluded. Based on the CCD analysis of the novel cutting processing, the optimal process parameters for damage-free cutting of 10 mm thick Al2O3 ceramics including peak power of 2.7~3.5 kW, pulse frequency of about 50 Hz, cycle duty of 30%~50% and piercing time of 0.1~0.5 s, are obtained. The optimal line cutting speed can be 15~20 mm/min.
    Ji Lingfei, Yan Yinzhou, Bao Yong, Chen Xiaochuan, Jiang Yijian. Research on Laser Close-Piercing Lapping Processing for Damage-Free Cutting of Thick Al2O3 Ceramics[J]. Chinese Journal of Lasers, 2011, 38(6): 603002
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