• Optics and Precision Engineering
  • Vol. 31, Issue 10, 1464 (2023)
Liqun DU1,2, Dejian KONG2,*, Shuai WANG2, Xiaoke CAI2, and Bingjiang GUO2
Author Affiliations
  • 1State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian6024, China
  • 2Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian11604, China
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    DOI: 10.37188/OPE.20233110.1464 Cite this Article
    Liqun DU, Dejian KONG, Shuai WANG, Xiaoke CAI, Bingjiang GUO. Study on interfacial bonding strength during fabrication of micro inertial switch[J]. Optics and Precision Engineering, 2023, 31(10): 1464 Copy Citation Text show less
    Component diagram of microinertial switch
    Fig. 1. Component diagram of microinertial switch
    Microelectroforming layer warped off
    Fig. 2. Microelectroforming layer warped off
    Passivated film-Ni bonded layer system
    Fig. 3. Passivated film-Ni bonded layer system
    Stainless steel -Ni bonded layer system
    Fig. 4. Stainless steel -Ni bonded layer system
    Passivation film removal rate of 50% doping structure-Ni binding layer system
    Fig. 5. Passivation film removal rate of 50% doping structure-Ni binding layer system
    Binding energy of the system varies with temperature under different passivation film removal rates
    Fig. 6. Binding energy of the system varies with temperature under different passivation film removal rates
    Model of bonding layer system between transition metal and stainless steel substrate
    Fig. 7. Model of bonding layer system between transition metal and stainless steel substrate
    Binding energy of the four systems varies with temperature
    Fig. 8. Binding energy of the four systems varies with temperature
    Binding energy of Cu, Cr, Ti and Ni castings varies with temperature
    Fig. 9. Binding energy of Cu, Cr, Ti and Ni castings varies with temperature
    Surface morphology of substrate at different time of electrolysis activation
    Fig. 10. Surface morphology of substrate at different time of electrolysis activation
    Experimental structure of copper transition layer experiment
    Fig. 11. Experimental structure of copper transition layer experiment
    Morphology of microelectroforming layer falls off is not fallingafter ultrasonic vibration
    Fig. 11. Morphology of microelectroforming layer falls off is not fallingafter ultrasonic vibration
    Surface morphology of the substrate before and after Cu layer was prepared
    Fig. 12. Surface morphology of the substrate before and after Cu layer was prepared
    Fabrication process of micro inertial switch
    Fig. 13. Fabrication process of micro inertial switch
    Experimental apparatus for electrolytic activation
    Fig. 14. Experimental apparatus for electrolytic activation
    Cu transition layer uniformly covering the surface of microstructure
    Fig. 15. Cu transition layer uniformly covering the surface of microstructure
    Completed micro inertial switch
    Fig. 16. Completed micro inertial switch
    Microswitch production process of the overall picture of the experimental piece
    Fig. 17. Microswitch production process of the overall picture of the experimental piece

    Material

    name

    Binding energy of stainless steel

    (kJ·mol-1

    Interface bonding strength of stainless steel(Ni-stainless steel as 1)Binding energy of Ni(kJ·mol-1

    Interfacial bonding strength of Ni

    (Ni-stainless steel as 1)

    Cu4.674×1041.8112.936×1045.01
    Ti3.925×1041.525.446×1042.11
    Ni2.583×1041\\
    Cr1.794×1040.697.313×1042.83
    Stainless steel\\2.583×1041
    Table 1. Relationship between the mean value of binding energy of different systems
    ProjectNumerical value/Condition
    Voltage/V15
    ElectrolyteWt 15%NaCl
    Electrolyte temperature /℃25
    Time/s0,20,40,60
    Duty cycle/%15
    Frequency/kHz25
    Substrate materialSUS 316
    Table 2. Experimental parameters of electrolytic activation
    Test sampleUltrasonic vibration timePassivation film removal rateExperimental result
    Inactivation3 min 30 s0%Electroforming layer falls off
    Activation 20 s15 min20%Electroforming layer is intact
    Activation 40 s15 min60%Electroforming layer is intact
    Activation 60 s15 min85%Electroforming layer is intact
    Table 3. Measurement results of interface bonding strength in electrolysis activation experiment
    Test sampleStart shedding timeComplete shedding timeExperimental result
    No Cu layer1 min 45 s3 min 27 sNi layer falls off
    Cu layer4 min 15 s6 min 22 sNi layer falls off
    Table 4. Measurement results of interface bonding strength of copper transition layer
    Liqun DU, Dejian KONG, Shuai WANG, Xiaoke CAI, Bingjiang GUO. Study on interfacial bonding strength during fabrication of micro inertial switch[J]. Optics and Precision Engineering, 2023, 31(10): 1464
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