Author Affiliations
1School of Mechanical and Automotive Engineering, Shanghai University of Engineering Science, Shanghai 201620, China2Department of Mechanical Engineering, Iowa State University, Iowa 50011, USA3College of Engineering Science and Technology, Shanghai Ocean University, Shanghai 201306, China4School of Power and Mechanical Engineering, Wuhan University, Wuhan, Hubei 430072, Chinashow less
Fig. 1. Simulation of near field optical, thermal, and stress fields of the tip under laser irradiation
[8]. (a) Configuration of the tip-substrate system under modeling; (b) geometric configuration of the tip;(c) evolution of the laser intensity, apex temperature, and elongation (thermal expansion) with time; (d) Poynting vector distribution around the tip
Fig. 2. Microscale spatially resolved thermal response of Si tip to laser irradiation
[9]. (a) SEM image of the front plane of the AFM silicon tip; (b) SEM image of the side plane of the AFM silicon; (c) positional relationship between the laser beam at the focal spot and the tip when the laser illuminates the tip side; (d) the moving directions of laser spot with respect to the tip during the experiment; (e) Raman shift, temperature, and Raman intensity v
Fig. 3. Noncontact temperature measurement in near-field laser heating
[11]. (a) Schematic of experimental setup for thermal probing using the apertureless NSOM; (b) relationship between the measured silicon surface temperature and laser spot position on the tip (a weak laser scattering intensity in the
x axis indicates the laser spot is on tip apex, while a strong scattering intensity indicates the laser spot is on the upper part of the tip near t
Fig. 4. Simulation of near-field optical field in silicon tip
[11].(a) Tip-substrate domain in the simulation; (b) front view of the electric field around the tip distributed in the
y=0 plane; (c) top view and cross-sectional view of the electric field around the tip under the tip apex; (d)electric field distribution in the
A-A' plane; (e) electric field distribution in the cross-section; (f) schematic of the thermal resistance calculation o
Fig. 5. Nanoscale mapping of physics fields under 1210 nm silica micro-particles assisted near-field heating
[14]. (a) Under different laser irradiation energy, the variation of Raman intensity
I along the mapping direction; (b) variations of Raman intensity
I, Raman shift
ω, and linewidth
Γ of silicon in the
x direction with laser intensity of 3.1×10
9 W/m
2; (c) deviation between the laser beam axis
Fig. 6. Spatial resolution limit of silica microsphere assisted near-field detection
[14].(a) Trend of
Imax/
Imin against the diameter of the silica particle; (b) variation of Raman intensity
I along the
x direction for a silicon wafer under a 200 nm diameter silica particle
Fig. 7. Simulation and error analysis of electric and temperature fields in silica particles and the silicon substrate
[14]. (a) Modeling results of the electric field for two situations: laser spot on a single particle and between two particles; (b) under the near-field focused laser heating, silicon wafer temperature variation along the thickness (
z) direction directly under a 1210 nm silica particle, and the inset shows the temperature distribut
Fig. 8. Optical field, temperature field, and thermal stress field at the surface and in cross-section of the silicon substrate
[15]. (a) Optical field; (b) temperature field; (c) thermal stress field introduced by the temperature rise
Fig. 9. Schematics of MD model and laser beam absorption in the material
[19]. (a) Schematic of MD model; (b) schematic of laser beam absorption in the material
Fig. 10. Temperature distribution and evolution in
x-z cross-section
[19] Fig. 11. Normal stress
σrr(MPa) development and propagation in
x-y plane
[19] Fig. 12. Snapshots of argon atom positions in
x-z cross-section at different moments
[19] Fig. 13. Solidification and epitaxial regrowth in surface nanostructuring
[20]. (a) Snapshots of argon atom positions in
x-z cross-section during a long time solidification; (b) magnification in the
x-z cross-section at
t=2 ns to show the epitaxial growth and atomic dislocation
Fig. 14. Distribution of function
Φ(
ri,z) at different times in
x-z cross-section
[20] Fig. 15. Effects of laser fluence on solidification of melts
[21]. (a) Evolution of thickness and lowest melting position of the molten material with time; (b) final surface profiles under different laser pulse energies after complete solidification
Fig. 16. Physical properties distribution in a cross-section of the system at 200 ps
[24]. (a) Density (nm
-3); (b) temperature (K); (c) pressure (MPa)
Fig. 17. Evolution of shock wave front temperature, position and Mach number with time
[24] Fig. 18. Evolution of atom positions during shock wave formation and propagation for different cases (
β=
Mgas/
Msolid,
λ=
pambient/
pref) at different instants
[25] (red dots: target atoms; blue dots: ambient gas atoms)
Domain | Sample 1 | Sample 2 | Sample 3 |
---|
FCC cubes in the domain(x×y×z) | 5×324×60 | 5×648×60 | 5×324×120 | Domain size /(nm× nm×nm) | 2.707×175.4×32.48 | 2.707×350.8×32.48 | 2.707×175.4×64.97 | Atom number | 388800 | 777600 | 777600 |
|
Table 1. Detailed information about the three computational domains studied in Ref.[21]