Author Affiliations
1State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an, Shaanxi 710054, China2Chinese People's Liberation Army 63850 Army, Baicheng, Jilin 137000, China3State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, Shaanxi 710049, Chinashow less
Fig. 1. Working principle of LCD technology
[13] Fig. 2. Size of standard tensile specimen
Fig. 3. Dimensional schematic of horizontal and vertical specimens. (a) Vertical specimen; (b) horizontal specimen
Fig. 4. Microstructures of deposited LCD-TC4 with different boron mass fractions. (a) 0; (b) 0.025%; (c) 0.050%; (d) 0.075%;(e) 0.100%
Fig. 5. SEM morphologies of tensile fractures of deposited LCD-TC4 with different boron mass fractions. (a) 0.025%; (b) 0.050%; (c) 0.075%; (d) 0.100%
Fig. 6. Mechanical properties of different LCD-TC4 specimens
Fig. 7. Microstructural morphologies of LCD-TC4 specimens prepared under different process methods. (a) Non-induction heating with boron; (b) induction heating with boron; (c) non-induction heating and heat treatment with boron; (d) induction heating and heat treatment with boron
Fig. 8. Anisotropy of LCD-TC4 prepared under different process methods
Fig. 9. Microstructural morphologies of LCD-TC4 with boron in transverse and longitudinal directions after heat treatment. (a) Horizontal direction; (b) vertical direction
TC4 | Mass fraction /% |
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Al | V | Fe | C | O | N | H | Ti |
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Powder | 6.1 | 4.1 | 0.10 | 0.01 | 0.13 | <0.01 | 0.001 | Bal. | Substrate | 6.2 | 4.3 | 0.13 | 0.02 | 0.12 | 0.01 | 0.002 | Bal. |
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Table 1. Main chemical compositions of TC4 powder and TC4 substrate
[13] Laserpower /W | Scanningspeed /(mm·s-1) | Powderdelivery /(g·min-1) | Lapdistance /mm | Liftamount /mm | Powerdensity /(J·mm-2) |
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180 | 10 | 2.5 | 0.2 | 0.1 | 30.5 |
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Table 2. Process parameters of LCD
Mass fraction of boron /% | Tensile strength /MPa | Yield strength /MPa | Elongation /% | Reduction of area /% |
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0 | 1200±10 | 1135±8 | 5.1±2.5 | 17.1±2.6 | 0.025 | 1052±5 | 975±6 | 11.2±2.7 | 27.7±2.6 | 0.050 | 1136±6 | 1048±8 | 11.5±0.2 | 33.5±5.3 | 0.075 | 1147±3 | 1057±9 | 10.7±2.8 | 19.6±4.3 | 0.100 | 1158±5 | 1066±7 | 10.5±3.7 | 12.7±5.3 | ASTM B381-05 | 895 | 825 | 8 | 25 |
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Table 3. Results of tensile test of deposited LCD-TC4 specimens with different boron mass fractions
Process method | Direction | Tensilestrength /MPa | Yiledstrength /MPa | Elongation /% | Reduction ofarea /% |
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Process 1 | H | 1149±7 | 1050±6 | 4.30±0.70 | 13.5±1.2 | | V | 1063±3 | 960±4 | 12.10±0.60 | 31.7±2.7 | Process 2 | H | 1058±4 | 953±5 | 8.80±0.50 | 22.7±0.9 | | V | 1035±9 | 945±7 | 13.50±1.30 | 41.5±2.7 | Process 3 | H | 1174±9 | 1093±8 | 9.75±0.75 | 21.5±0.5 | | V | 1136±6 | 1048±8 | 11.50±0.20 | 33.5±5.3 | Process 4 | H | 1043±4 | 968±5 | 16.70±0.80 | 37.3±2.1 | | V | 1051±4 | 951±2 | 16.00±0.40 | 36.0±1.0 | ASTM B381-05 | | 895 | 825 | ≥8.00 | ≥25.0 |
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Table 4. Tensile test data of boron-containing LCD-TC4 samples in different directions before and after heat treatment