Fig. 1. Flowchart of laser remelting/electrochemical deposition interaction experiment

Fig. 2. Schematic of electrochemical deposition device

Fig. 3. SEM morphologies of surface after laser treatment. (a) After laser melting pretreatment; (b) after laser remelting

Fig. 4. SEM morphologies of deposited layer surface under laser remelting/electrochemical deposition interaction treatment and conventional electrodeposition process, where the “10” in the figure represents electrodeposition for 10 min and the letter “L” represents laser remelting. (a) Electrodeposition 10 min after laser melting pretreatment; (b) electrodeposition 10 min after the first laser remelting treatment; (c) electrodeposition 10 min after the second laser remelting treatment; (d) conventional electrodeposition for 30 min

Fig. 5. Distribution interval of particle size scale of deposited layer under laser remelting/electrochemical deposition interaction treatment and conventional electrodeposition process. (a) Interactive treatment; (b) conventional electrodeposition

Fig. 6. Surface roughness of deposited layer under laser remelting/electrochemical deposition interaction treatment and conventional electrodeposition process. (a) Interactive treatment; (b) conventional electrodeposition

Fig. 7. Element distribution of cross-section under laser remelting/electrochemical deposition interaction treatment. (a) Electrodeposition 10 min after laser melting pretreatment; (b) electrodeposition 10 min after the first laser remelting treatment; (c) electrodeposition 10 min after the second laser remelting treatment

Fig. 8. Section thickness of deposited layer under laser remelting/electrochemical deposition interaction treatment and traditional electrodeposition process. (a) Electrodeposition 10 min after laser melting pretreatment; (b) electrodeposition 10 min after the first laser remelting treatment; (c) electrodeposition 10 min after the second laser remelting treatment; (d) conventional electrodeposition for 30 min

Fig. 9. XRD phase analysis of composite remelting layer (Ti/Cu composite coating by laser remelting) under laser remelting/electrochemical deposition interaction treatment

Fig. 10. Acoustic emission spectra of deposited layer and composite remelting layer under different laser remelting/electrochemical deposition interaction treatment times

Fig. 11. SEM morphologies of scratches of deposited layer under laser remelting/electrochemical deposition interaction treatment. (a) Electrodeposition 10 min after laser melting pretreatment; (b) electrodeposition 10 min after the first laser remelting treatment; (c) electrodeposition 10 min after the second laser remelting treatment

Fig. 12. SEM morphologies of scratch of composite remelting layer obtained by laser remelting/electrochemical deposition interaction treatment. (a) The first laser remelting treatment after electrodeposition 10 min; (b) the second laser remelting treatment after electrodeposition 20 min; (c) the third laser remelting treatment after electrodeposition 30 min

Fig. 13. Oxidative weight gain of interaction-deposited samples and conventional electrodeposition samples at 600 ℃

Fig. 14. Electrical resistivity of coating samples under laser remelting/electrochemical deposition interaction treatment and conventional electrodeposition process

Fig. 15. Timing potential curves of copper electrodeposition process under laser remelting/electrochemical deposition interaction treatment

Fig. 16. Schematic of laser remelting/electrochemical deposition interaction treatment

Table 1. Process parameters of laser melting treatment and laser remelting

Table 2. Composition and content of electrodeposition solution

Table 3. Critical load of deposited layer and composite remelting layer under different laser remelting/ electrochemical deposition interaction treatment times