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    Journals >Chinese Journal of Lasers >Volume 52 >Issue 12 >Page 1202404 > Article
    • Chinese Journal of Lasers
    • Vol. 52, Issue 12, 1202404 (2025)
    Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating
    Pengfei Yang1, Bingjun Luo1,2, Zhiheng Wu3, Xinhong Su4..., Liang Li4, Likui Jin4 and Jiangyou Long1,*|Show fewer author(s)
    Author Affiliations
  • 1School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, Guangdong , China
  • 2Guangdong Engineering Technology Research Center of Intelligent Inspection and Laser Precision Repair, Guangdong Greatsense Intelligent Equipment Co. Ltd., Guangzhou 510700, Guangdong , China
  • 3Universal Circuit Board Equipment Co. Ltd., Dongguan 523000, Guangdong , China
  • 4Zhuhai Founder Technology High Density Electronic Co. Ltd., Zhuhai 519000, Guangdong , China
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    DOI: 10.3788/CJL241400 Cite this Article Set citation alerts
    Pengfei Yang, Bingjun Luo, Zhiheng Wu, Xinhong Su, Liang Li, Likui Jin, Jiangyou Long. Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating[J]. Chinese Journal of Lasers, 2025, 52(12): 1202404 Copy Citation Text show less

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    Pengfei Yang, Bingjun Luo, Zhiheng Wu, Xinhong Su, Liang Li, Likui Jin, Jiangyou Long. Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating[J]. Chinese Journal of Lasers, 2025, 52(12): 1202404
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    Paper Information
    Recommended Topics
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