• Acta Photonica Sinica
  • Vol. 45, Issue 5, 514001 (2016)
WANG Shu-na1、*, ZHANG Pu1, XIONG Ling-ling1, NIE Zhi-qiang1, WU Di-hai1, and LIU Xing-sheng1、2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/gzxb20164505.0514001 Cite this Article
    WANG Shu-na, ZHANG Pu, XIONG Ling-ling, NIE Zhi-qiang, WU Di-hai, LIU Xing-sheng. Influence of Temperature on “Smile” in High Power Diode Laser Bars[J]. Acta Photonica Sinica, 2016, 45(5): 514001 Copy Citation Text show less
    References

    [1] LI U Xing-sheng. Packaging of high power semiconductor lasers[M]. ZHAO Wei, XIONG Ling-ling, LIU Hui. New York: Springer Science, 2015.

    [2] FRIEDRICH B. High power diode lasers technology and applications[M]. PETER L, REINHART P. New York: Springer Science, 2015.

    [3] FAIRCLOTH B. Present technology industrial applications and future prospects of high power diode lasers, Proceedings of SPIE- International Conference on Advanced Laser Technologies[C]. San Jose: SPIE, 2002, 1-15.

    [4] LIU Xing-sheng, DAVIS R W, HUGHES L C, et al. A study on the reliability of indium solder die bonding of high power semiconductor lasers [J]. Journal of Applied Physics, 2006, 100(013104): 013104.

    [5] WANG Jing-wei, YUAN Zhen-bang, KANG Li-jun, et al. Study of the mechanism of “smile” in high power diode laser arrays and strategies in improving near-field linearity, Proceedings of 59th Electronic Components and Technology Conference [C]. Piscataway: Institute of Electrical and Electronics Engineers Inc., 2009, 837-842.

    [6] GUO Lin-hui, TANG Chun, WU De-yong, et al. Measurement of “smile” for high power diode laser array[J]. High Power Laser and Particle Beams, 2009, 21(2): 195-198.

    [7] WANG Xiang-peng, LI Zai-jin, LIU Yun, et al. Smile effect and package technique for diode laser arrays[J]. Optical and Precision Engineering, 2010, 18(3): 552-557.

    [8] LANG Chao, YAO Shun, CHEN Bing-zhen, et al. “Smile” effect on the beam quality for diode laser arrays[J]. Chinese Journal of Laser, 2012, 39(5): 0502006.

    [9] MARTN-MARTN A, AVELLA M, IN~IGUEZ M P, et al. Thermomechanical model for the plastic deformation in high power laser diodes during operation[J]. Journal of Applied Physics, 2009, 106(7): 073105.

    [10] YAN Yi, GUAN You-liang, CHEN Xu, et al. Effects of voids in sintered silver joint on thermal and optoelectronic performances of high power laser diode [J]. Journal of Electronic Packaging, 2013, 135(4): 041003.

    [11] SCHOLZ C. Thermal and mechanical optimization of diode laser bar packaging [D]. Aachen: RWTH Aachen University of Technology, 2007.

    [12] WANG Jing-wei, YUAN Zhen-bang, ZHANG Yan-xin, et al. Study of the mechanisms of spectral broadening in high power semiconductor laser arrays[J]. Chinese Journal of Laser, 2010, 37(1): 92-99.

    [13] STAKSE R, SEBASTIEN J, WENZEL J, et al. Influence of mounting stress on polarization degree of electroluminescence of laser diode bars, Conference on Lasers and Electro-Optics Europe - Technical Digest[C]. Piscataway: IEEE, 2000, 10-15.

    [14] LI Xiao-ning, ZHANG Yan-xin, WANG Jing-wei, et al. Influence of package structure on the performance of the single emitter diode laser[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(10): 1592-1598.

    [15] SCHLEUNING D, SCHOLZ K, GRIFFIN M, et al. Material survey for packaging semiconductor diode lasers, Proceedings of SPIE –High Power Diode Laser Technology and Applications[C]. Bellingham WA: SPIE, 2009, 71981K.

    [16] MARK L B, STEVEN D, KELSEY P, et al. Spectroscopic method of strain analysis in semiconductor quantum-well devices[J]. Journal of Applied Physics, 2004, 96(8): 4056-4065.

         Foundation item: The National Natural Science Foundation of China (Nos. 61334010, 61404172)

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    WANG Shu-na, ZHANG Pu, XIONG Ling-ling, NIE Zhi-qiang, WU Di-hai, LIU Xing-sheng. Influence of Temperature on “Smile” in High Power Diode Laser Bars[J]. Acta Photonica Sinica, 2016, 45(5): 514001
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