Compared with traditional methods, conductor fabricaton technology by laser micro cladding electronic pastes (LMCEP) can improve the efficiency and lower the production cost. In this paper, processes of silver conductor fabrication were studied. The effect of laser power density and scanning speed on conductor thickness and linewidth was researched systematically, at the same time, the effect of firing time on resistivity and adhesion strength was also analyzed. The result showed that, they which had critical values had very little effect on thickness of conductor and played a very important role on its linewidth, and with increasing the power density and decreasing the scanning speed, the linewidth increased. Besides, with the delaying of sintering time, the resistivity decreased and adhesion strength enhanced, on base of which the conductive and adhesive mechanisms were explored too.