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    Journals >Chinese Journal of Lasers >Volume 20 >Issue 7 >Page 558 > Article
    • Chinese Journal of Lasers
    • Vol. 20, Issue 7, 558 (1993)
    Laser cutting of dry diamond saw substrates
    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], and [in Chinese]
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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Laser cutting of dry diamond saw substrates[J]. Chinese Journal of Lasers, 1993, 20(7): 558 Copy Citation Text show less

    Abstract

    Laser cutting of dry diamond saw substrates made by cold-rolled steel sheet (1.2 mm thick) is described, the technological parameters test results and the factors affecting cutting quality are discussed.

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Laser cutting of dry diamond saw substrates[J]. Chinese Journal of Lasers, 1993, 20(7): 558
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    Recommended Topics
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