Analysis and Optimization of Two Gluing Processes for Frames and Chips Bonding

Zhi-pan FENG; Ran ZHANG; Zhi-kai FU; Guan WANG

doi:10.3969/j.issn.1672-8785.2022.08.005

Journals >INFRARED >Volume 43 >Issue 8 >Page 26 > Article

INFRARED
Vol. 43, Issue 8, 26 (2022)

Analysis and Optimization of Two Gluing Processes for Frames and Chips Bonding

Zhi-pan FENG^*, Ran ZHANG, Zhi-kai FU, and Guan WANG

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[in Chinese]

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DOI: 10.3969/j.issn.1672-8785.2022.08.005 Cite this Article

FENG Zhi-pan, ZHANG Ran, FU Zhi-kai, WANG Guan. Analysis and Optimization of Two Gluing Processes for Frames and Chips Bonding[J]. INFRARED, 2022, 43(8): 26 Copy Citation Text

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FENG Zhi-pan, ZHANG Ran, FU Zhi-kai, WANG Guan. Analysis and Optimization of Two Gluing Processes for Frames and Chips Bonding[J]. INFRARED, 2022, 43(8): 26

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