As an important technical equipment in the emerging field of additive manufacturing technology, 3D printer has been finding its way into more fields. In the working process of a 3D printer, the temperature control of the printing material ensures the printing quality and printing effect. For the development of a droplet jet array print head, considering the strict constraints in terms of device size, power consumption and other aspects, conventional methods with Field Programmable Gate Array(FPGA) or Microcontroller Unit(MCU) based architectures are no longer applicable, and the develoment of a temperature control Application-Specific Integrated Circuit(ASIC) becomes necessary, which will be included in an integrated package with other control circuits. Targeting the need of the development of an array print head, this paper proposes the architecture of a temperature control ASIC, and completes the front-end design, prototype verification, and backend design. The chip layout area is 740 μm×740 μm, which meets the design requirements and is applicable for use in the 3D printing head.