Nowadays, the electronic components are developing towards to high density compaction and miniaturization, which needs higher line densities and narrower line widths for interior interconnected conductive lines. However, the conventional technologies can not meet the rapidly growing need for their inherent limits. In this paper, based on the technique of laser micro-fine cladding and flexibly direct writing, micro-fine conductive lines of high quality and high property are fabricated on glass substrates. The properties and quality of conductive lines are adjusted by structure change with different processing parameters, so as to optimize parameters and make use of these parameters to fabricate the case patterns. The results showed that the conductive and welding properties of the conductive lines are high as well as bond strength and surface finish quality, therefore they are fit for fabrication and repair of products′ intellectual large-lot production and fine or micro-fine patterns.