• Journal of Terahertz Science and Electronic Information Technology
  • Vol. 21, Issue 5, 639 (2023)
QI Siyao1、*, ZHAO Zhaoxia1, LIU Yao1, MA Tianbao1, MI Chaguo1, LUO Tingfang1, WANG Qiulin2, ZHANG Yi1, and HUANG Kama1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.11805/tkyda2022221 Cite this Article
    QI Siyao, ZHAO Zhaoxia, LIU Yao, MA Tianbao, MI Chaguo, LUO Tingfang, WANG Qiulin, ZHANG Yi, HUANG Kama. Experimental study on solder paste welding by microwave separated field[J]. Journal of Terahertz Science and Electronic Information Technology , 2023, 21(5): 639 Copy Citation Text show less
    References

    [1] NOWOTTNICK M, SCHEEL W, PAPE U, et al. A simultaneous and selective microwave supported soldering technology[R]. German Department for Education and Research, 2006.

    [3] QU L, ZHAO N, ZHAO H, et al. In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction[J]. Scripta Materialia, 2014,72(2):43-46.

    [4] YAZZIE K E,XIE H X,WILLIAMS J J,et al. On the relationship between solder-controlled and Intermetallic Compound(IMC)-controlled fracture in Sn-based solder joints[J]. Scripta Materialia, 2012,66(8):586-589.

    [5] HU X,QIU Y,JIANG X,et al. Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys[J]. Journal of Materials Science:Materials in Electronics, 2018,29(18):15983-15993.

    [6] HO C E,TSAI R Y,LIN Y L,et al. Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni[J]. Journal of Electronic Materials, 2002,31(6):584-590.

    [7] LUTFI M,YUSOF F,RAMESH S,et al. Effect of microwave hybrid heating on the formation of intermetallic compound of Sn-Ag-Cu solder joints[C]// Proceedings of the 36th International Electronics Manufacturing Technology Conference. Johor Bahru, Malaysia:IEEE, 2014.

    [8] MOON K S, LI Y, XU J W, et al. Lead-free interconnect technique by using variable frequency microwave[C]// The 54th Electronic Components and Technology Conference. Las Vegas,NV,USA:IEEE, 2004:1989-1995.

    [9] SAID M,NAZERI M F M,SHARIF N M,et al. Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn-3.0 Ag-0.5 Cu/Cu solder joints[J]. Soldering & Surface Mount Technology, 2021,34(1):31-44.

    [10] YOSHIKAWA N,ISHIZUKA E,TANIGUCHI S. Heating of metal particles in a single-mode microwave applicator[J]. Materials Transactions, 2006,47(3):898-902.

    [11] PANDA S S, SINGH V, UPADHYAYA A, et al. Sintering response of austenitic(316L) and ferritic(434L) stainless steel consolidated in conventional and microwave furnaces[J]. Scripta Materialia, 2006,54(12):2179-2183.

    [12] UPADHYAYA A,TIWARI S,MISHRA P. Microwave sintering of W-Ni-Fe alloy[J]. Scripta Materialia, 2007,56(1):5-8.

    [14] ZHANG Y, AGRAWAL D K, CHENG J P, et al. Microwave power absorption mechanism of metallic powders[J]. IEEE Transactions on Microwave Theory and Techniques, 2018,66(5):2107-2115.

    QI Siyao, ZHAO Zhaoxia, LIU Yao, MA Tianbao, MI Chaguo, LUO Tingfang, WANG Qiulin, ZHANG Yi, HUANG Kama. Experimental study on solder paste welding by microwave separated field[J]. Journal of Terahertz Science and Electronic Information Technology , 2023, 21(5): 639
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