• Chinese Journal of Lasers
  • Vol. 34, Issue s1, 218 (2007)
[in Chinese]*, [in Chinese], [in Chinese], and [in Chinese]
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  • [in Chinese]
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    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Conductor Fabrication with Laser Micro-Cladding Electronic Pastes on Si Substrate[J]. Chinese Journal of Lasers, 2007, 34(s1): 218 Copy Citation Text show less
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    [2] A. J. Castro, R. P. van Duyne, K. C. Sheng et al.. Laser direct writing [P]. U.S. Patent, 5378508, 1995.

    [3] Hirofumi Hidai, Hitoshi Tokura. Drect laser writing of aluminum and copper on glass surfaces from metal powder [J]. Applied Surface Science, 2001, 174(2): 118~124

    [4] X. Li, H. Li, Y. Chen et al.. Silver conductor fabrication by laser direct writing on Al2O3 substrate [J]. Appl. Phys. A, 2004, 79(8): 1861~1863

    [5] Xiangyou Li, Xiaoyan Zeng, Huiling Li et al.. Laser direct fabrication of silver conductors on glass substrate[J]. Thin Solid Films, 2005, 483(1~2): 270~275

    [6] Xiangyou Li, Huiling Li, Jingwei Liu et al.. Conductive line preparation on resin surfaces by laser micro-cladding conductive pastes [J]. Applied Surface Science, 2004, 233(1~4): 51~57

    [7] Li Xiangyou. Research of Arts, Mechanisms and System in Conductor Fabrication by Laser Micro Cladding Electronic Pastes [D]. Wuhan: Huazhong University of Science & Technology Library, 2003. 3

    [8] Hao Yu, Zhang Jianjun. The package process develop trend of little consume electronic production [C]. The sixth SMT/SMD conference papers of Chinese electronic association, 288~298

    [9] Li Yaolin. Thick-Film Electronic Components [M]. Guangzhou: Huanan University of Science & Technology Publishing Company, 1991. 28~34

    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Conductor Fabrication with Laser Micro-Cladding Electronic Pastes on Si Substrate[J]. Chinese Journal of Lasers, 2007, 34(s1): 218
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