NIE Lei, HUANG Yifan, CAI Wentao, LIU Mengran. Research on Internal Defect Recognition Method of TSV 3D Package Based on Thermoelectric Coupling Excitation[J]. Semiconductor Optoelectronics, 2021, 42(5): 692
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- Semiconductor Optoelectronics
- Vol. 42, Issue 5, 692 (2021)
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