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    Journals >Journal of Terahertz Science and Electronic Information Technology >Volume 22 >Issue 7 >Page 758 > Article
    • Journal of Terahertz Science and Electronic Information Technology
    • Vol. 22, Issue 7, 758 (2024)
    Design of 3D heterogeneous film-based transceiver SiP module in X-band
    LI Xiaolin*, LIU Xing, GAO Yanhong, ZHAO Yu, and XU Chunliang
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    DOI: 10.11805/tkyda2023396 Cite this Article
    LI Xiaolin, LIU Xing, GAO Yanhong, ZHAO Yu, XU Chunliang. Design of 3D heterogeneous film-based transceiver SiP module in X-band[J]. Journal of Terahertz Science and Electronic Information Technology , 2024, 22(7): 758 Copy Citation Text show less
    References

    [7] LIU Enda, WU Hongjiang, ZHAO Yongzhi. Design of phased array T/R component microsystem based on heterogeneous integration technology[J]. Journal of Physics:Conference Series, 2019(1325):012010. doi:10.1088/1742-6596/1325/1/012010.

    [12] ZHAO Yongzhi,WANG Shaodong,WU Hongjiang. A novel dual channel receive front-end module with MEMS technology[C]// 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility. Suntec City,Singapore:IEEE, 2018:674-677. doi:10.1109/ISEMC.2018.8393866.

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    LI Xiaolin, LIU Xing, GAO Yanhong, ZHAO Yu, XU Chunliang. Design of 3D heterogeneous film-based transceiver SiP module in X-band[J]. Journal of Terahertz Science and Electronic Information Technology , 2024, 22(7): 758
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