Jianchao WANG, Tian BAI, Lin KONG, Feng JIANG, Lei ZHANG. Optimization Design of the Heat Transfer Path for a TDI-CMOS Focal Plane Assembly[J]. Spacecraft Recovery & Remote Sensing, 2024, 45(2): 92

Search by keywords or author
- Spacecraft Recovery & Remote Sensing
- Vol. 45, Issue 2, 92 (2024)
![[in Chinese]](/richHtml/htfhyg/2024/45/2/92/img_1.jpg)
Fig. 1. [in Chinese]
![[in Chinese]](/richHtml/htfhyg/2024/45/2/92/img_2.jpg)
Fig. 2. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 3. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 4. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 5. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 6. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 7. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 8. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 9. [in Chinese]
![[in Chinese]](/Images/icon/loading.gif)
Fig. 10. [in Chinese]
|
Table 1. Table of thermal physical parameters of the focal plane assembly
|
Table 2. Physical properties of the phase change material
|
Table 3. Temperature variation of CMOS under different heat transfer schemes
|
Table 4. Temperature of each component after optimization ℃

Set citation alerts for the article
Please enter your email address