• Spacecraft Recovery & Remote Sensing
  • Vol. 45, Issue 2, 92 (2024)
Jianchao WANG, Tian BAI, Lin KONG*, Feng JIANG, and Lei ZHANG
Author Affiliations
  • Chang Guang Satellite Technology CO., LTD., Changchun 130033, China
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    DOI: 10.3969/j.issn.1009-8518.2024.02.009 Cite this Article
    Jianchao WANG, Tian BAI, Lin KONG, Feng JIANG, Lei ZHANG. Optimization Design of the Heat Transfer Path for a TDI-CMOS Focal Plane Assembly[J]. Spacecraft Recovery & Remote Sensing, 2024, 45(2): 92 Copy Citation Text show less
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    组件名称主要材料热导率/(W∙m−1∙K−1比热容/(J∙kg−1∙K−1发热功率/W质量/g
    外壳铝合金12192102 100
    PCB-A耐燃材料FR4法向:0.38;平面:34.441 4653.7155
    PCB-B耐燃材料FR42.358
    PCB-C1耐燃材料FR421.3247
    PCB-C2耐燃材料FR4677
    CMOS传感器陶瓷307502.7117
    Table 1. Table of thermal physical parameters of the focal plane assembly
    材料名称相变温度/℃相变潜热/(J∙g−1热导率/(W∙m−1∙K−1密度/(g/cm3比热容/(J∙kg−1∙K−1
    S-1616~182300.20.722000
    Table 2. Physical properties of the phase change material
    方案名称600 s后温度/℃温升/℃提升效果/℃提升百分比/%
    自然状态33.818.8
    基板热容法30.515.53.318
    针脚热容法2499.852
    侧面接触法26.211.27.640
    Table 3. Temperature variation of CMOS under different heat transfer schemes
    组件名称优化前温度优化后温度提升效果
    基板24.915.99
    前屉23.116.76.4
    中屉24.417.76.7
    底板26.418.48
    后屉24.316.47.9
    盖板24.315.68.7
    CMOS传感器33.819.98.9
    PCB-A37.131.85.3
    PCB-B43.331.711.6
    PCB-C137.524.513
    PCB-C233.927.66.3
    Table 4. Temperature of each component after optimization
    Jianchao WANG, Tian BAI, Lin KONG, Feng JIANG, Lei ZHANG. Optimization Design of the Heat Transfer Path for a TDI-CMOS Focal Plane Assembly[J]. Spacecraft Recovery & Remote Sensing, 2024, 45(2): 92
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