• Semiconductor Optoelectronics
  • Vol. 43, Issue 2, 389 (2022)
JIANG Jian, ZOU Jiwei, CHEN Maosheng, YAN Long..., WEI Yiming and FANG Xiaowei|Show fewer author(s)
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    DOI: 10.16818/j.issn1001-5868.2021110402 Cite this Article
    JIANG Jian, ZOU Jiwei, CHEN Maosheng, YAN Long, WEI Yiming, FANG Xiaowei. Analysis and Suppression of Imaging Noise of Multi-TDICCD Remote Sensing Camera[J]. Semiconductor Optoelectronics, 2022, 43(2): 389 Copy Citation Text show less

    Abstract

    In order to solve the problem of imaging noise of multi-channel time delay integrated charge coupled device (TDICCD) splicing remote sensing camera, and improve the signal-to-noise ratio (SNR) and imaging quality, two main reasons for the noise of multi-TDICCD imaging were analyzed. First, the unsynchronized operation of the CCD causes the ground plane high-frequency disturbance of the power supply of the TDICCD imaging circuit, which affects the acquisition of the effective video signal of the adjacent channel CCD. Secondly, the switching noise disturbance of DC-DC power supply in the circuit affects the acquisition of CCD effective video signal. Based on the practice of engineering development, the multi-TDICCD imaging circuit system is improved by taking measures such as sharing a unified system clock and the same system reset between CCD channels to suppress the imaging crosstalk between channels. The interference of power supply noise on multi CCD imaging is suppressed by filtering the main interference source of DC-DC power supply and multi-point grounding of TDICCD port. The imaging and signal-to-noise ratio of the improved multi-channel TDICCD imaging circuit system were tested. The results show that the measures remove the imaging noise effectively and significantly improve the SNR by 2dB, and the excellent field imaging quality can meet the requirements of practical engineering.
    JIANG Jian, ZOU Jiwei, CHEN Maosheng, YAN Long, WEI Yiming, FANG Xiaowei. Analysis and Suppression of Imaging Noise of Multi-TDICCD Remote Sensing Camera[J]. Semiconductor Optoelectronics, 2022, 43(2): 389
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