Microcutting Si Wafer in Water Bath by the Second and Third Harmonic Output of YAG Laser

[in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]

Journals >Acta Photonica Sinica >Volume 34 >Issue 3 >Page 340 > Article

Acta Photonica Sinica
Vol. 34, Issue 3, 340 (2005)

Microcutting Si Wafer in Water Bath by the Second and Third Harmonic Output of YAG Laser

[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], and [in Chinese]

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[in Chinese]

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DOI: Cite this Article

[in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Microcutting Si Wafer in Water Bath by the Second and Third Harmonic Output of YAG Laser[J]. Acta Photonica Sinica, 2005, 34(3): 340 Copy Citation Text

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References

[1] Zhang J,Sugioka K,Midorikawa K. High-speed machining of glass materials by laser-induced plasma-assisted ablation using a 532 nm laser.App Phy A,1998,67(4):499～501

[2] MC Gower. Industrial applications of pulsed lasers to materials processing. SPIE,1998,3343:171～173

[3] Peyre P, Fabbro R, Berthe L,et al. Laser shock processing of materials, physical processes involved and examples of applications. Journal of Laser Applications,1996,8(3):135～141

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