Research on the Back-adding Technology of Type-II Superlattice Detector Chip

Xiu-juan REN; Ge CUI; Chun-ling LI; Xiao-yu FENG; Hai-yan LI; Ti NING; Jiao-jiao QI; ming LIU

doi:10.3969/j.issn.1672-8785.2021.12.003

Journals >INFRARED >Volume 42 >Issue 12 >Page 15 > Article

INFRARED
Vol. 42, Issue 12, 15 (2021)

Research on the Back-adding Technology of Type-II Superlattice Detector Chip

Xiu-juan REN^*, Ge CUI, Chun-ling LI, Xiao-yu FENG, Hai-yan LI, Ti NING, Jiao-jiao QI, and ming LIU

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[in Chinese]

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DOI: 10.3969/j.issn.1672-8785.2021.12.003 Cite this Article

REN Xiu-juan, CUI Ge, LI Chun-ling, FENG Xiao-yu, LI Hai-yan, NING Ti, QI Jiao-jiao, LIU ming. Research on the Back-adding Technology of Type-II Superlattice Detector Chip[J]. INFRARED, 2021, 42(12): 15 Copy Citation Text

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References

[7] Rogalski A. Material Considerations for Third Generation Infrared Photon Detectors Infrared[J]. Physics&Technology, 2007, 50(2): 240252.

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