• INFRARED
  • Vol. 46, Issue 2, 20 (2025)
Yi-nan ZHANG*
Author Affiliations
  • Shanghai Jiwu Optoelectronic Technology Co., Ltd., Shanghai 201815, China
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    DOI: 10.3969/j.issn.1672-8785.2025.02.003 Cite this Article
    ZHANG Yi-nan. Thermal Damage and Its Control in Helical Laser Processing of Infrared Module Electrode Plates for Packaging[J]. INFRARED, 2025, 46(2): 20 Copy Citation Text show less
    References

    [1] Rahim K, Mian A. A Review on Laser Processing in Electronic and MEMS Packaging [J]. Journal of Electronic Packaging, 2017, 139(3): 030801.

    [2] Schulz W, Eppelt U, Poprawe R. Review on laser drilling I. Fundamentals, modeling, and simulation [J]. Journal of Laser Applications, 2013, 25(1): 012006.

    [4] Hurley M J, Gottuk D, Hall J R, et al. SFPE Handbook of Fire Protection Engineering [M]. Berlin: Springer Nature, 2016.

    [5] Bergman T L, Lavine A S, Incropera F P, et al. Fundamentals of Heat and Mass Transfer [M]. Hoboken: John Wiley & Sons, 2018.

    ZHANG Yi-nan. Thermal Damage and Its Control in Helical Laser Processing of Infrared Module Electrode Plates for Packaging[J]. INFRARED, 2025, 46(2): 20
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