Jian QIAO, Zhenduo WU, Xinhan PENG, Yuxuan RAN, Jingwei YANG. Mechanism for laser-induced damage bad chip of Micro-LED and optimization of processing parameters[J]. Optics and Precision Engineering, 2024, 32(9): 1360
- Optics and Precision Engineering
- Vol. 32, Issue 9, 1360 (2024)
Fig. 1. Material structure of GAN-based Micro-LED sample
Fig. 2. Schematic diagram of femtosecond laser processing system
Fig. 3. Schematic diagram of two scan paths
Fig. 4. Squared diameters of ablated regions correlated with applied laser fluence
Fig. 5. Simulation results of vaporization temperature
Fig. 6. Simulation results of monopulse laser ablation
Fig. 7. Results of experimental and simulation ablated depth
Fig. 8. Comparison of surface topography of two scanning paths
Fig. 9. Surface morphology of chip ablated under different laser spot spacing
Fig. 10. Surface roughness of chip under different spacings
Fig. 11. Results of experimental and simulated ablative depth
Fig. 12. Three-dimensional morphology after removing chip
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Table 1. Main technical parameters of laser processing
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Table 2. Experimental parameters of laser-induced damage bad chip
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