As the integration and complexity of Monolithic Microwave Integrated Circuit(MMIC) increase, the distance among the chip functional modules is getting closer and closer, and the characteristic line width is getting narrower and narrower. For analyzing the signal path and signal integrity inside the chip, it is particularly important to provide high-resolution microwave field imaging of the chip surface. In order to solve the problem of accurately detecting the integrity of the internal structure of the chip, this work uses a fiber based near-field scanning probe method, in which the diamond particle containing the nitrogen vacancy(NV) center is fixed at the tip of the fiber by building the optical path and receiving the fluorescence signal of the diamond NV center, so as to infer the magnetic field strength of the chip under test. In this experiment, an area inside a microwave low-noise amplifier chip is selected for scanning imaging, good imaging results are obtained, and the signal line trend of the chip is accurately analyzed. These results provide a transformative method for the function and failure analysis of integrated devices such as highly integrated chips and filters. It has achieved good test results in application fields such as chip electromagnetic compatibility, integrated antenna near-field characterization and digital circuit signal integrity analysis.