• Electronics Optics & Control
  • Vol. 29, Issue 2, 82 (2022)
ZHAN Wentao, YANG Liu, and WANG Xiaobo
Author Affiliations
  • [in Chinese]
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    DOI: 10.3969/j.issn.1671-637x.2022.02.018 Cite this Article
    ZHAN Wentao, YANG Liu, WANG Xiaobo. Optical Interconnection for Airborne Integrated Modular Processor Platform[J]. Electronics Optics & Control, 2022, 29(2): 82 Copy Citation Text show less

    Abstract

    In avionics systems, there are two configurations of airborne integrated modular processor platform: one is LRM configured in a centralized cabin and the other is ARINC600 LRU installed on a bracket.As for the two configurations, their characteristics are described respectively.Based on the status quo of airborne optical interconnection technology, its engineering realization modes of optical-electric transformation and high-density interface transmission are introduced.The verification results of current optical interconnection methods are described, and then the direction of future improvement is discussed.
    ZHAN Wentao, YANG Liu, WANG Xiaobo. Optical Interconnection for Airborne Integrated Modular Processor Platform[J]. Electronics Optics & Control, 2022, 29(2): 82
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