• Electronics Optics & Control
  • Vol. 29, Issue 2, 82 (2022)
ZHAN Wentao, YANG Liu, and WANG Xiaobo
Author Affiliations
  • [in Chinese]
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    DOI: 10.3969/j.issn.1671-637x.2022.02.018 Cite this Article
    ZHAN Wentao, YANG Liu, WANG Xiaobo. Optical Interconnection for Airborne Integrated Modular Processor Platform[J]. Electronics Optics & Control, 2022, 29(2): 82 Copy Citation Text show less

    Abstract

    In avionics systems, there are two configurations of airborne integrated modular processor platform: one is LRM configured in a centralized cabin and the other is ARINC600 LRU installed on a bracket.As for the two configurations, their characteristics are described respectively.Based on the status quo of airborne optical interconnection technology, its engineering realization modes of optical-electric transformation and high-density interface transmission are introduced.The verification results of current optical interconnection methods are described, and then the direction of future improvement is discussed.