Chunxia WU, Jianqiu MA, Zhishan GAO, Zhenyan GUO, Qun YUAN. Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation[J]. Optics and Precision Engineering, 2023, 31(3): 301
- Optics and Precision Engineering
- Vol. 31, Issue 3, 301 (2023)
Fig. 1. Optical path of Linnik near-infrared reflective micro interferometry system
Fig. 2. Modeling of TSV array hole with diameter of 10 μm and depth of 65 μm
Fig. 3. Electric field transmission diagram of probe light focused on points A and B
Fig. 4. Wavefront phase of points A and B
Fig. 5. Zernike polynomial fitting coefficients of aberration of points A and B
Fig. 6. Linnik near-infrared micro interferometry system
Fig. 7. Interferogram of top and bottom before aberration compensation
Fig. 8. Image evaluation function with 20 iterations of compensation
Fig. 9. Bottom image at 12 times of iterative compensation
Fig. 10. Interferograms of top and bottom after aberration compensation
Fig. 11. Interference signal intensity at one point on bottom before aberration compensation
Fig. 12. Interference signal intensity at one point on bottom surface after aberration compensation
Fig. 13. Results of TSV measurement by different methods
Fig. 14. Top and bottom interference patterns of 3.85∶1 aspect-ratio TSV with two methods
Fig. 15. Results of TSV with aspect ratio of 10.3∶1 by near-infrared micro interferometry based on aberration compensation
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Table 1. Ten measurements of depth of one hole in TSV using near-infrared micro interferometry
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