Bonding-Surface-Cleaning Technology for Preparing Piezoelectric Single-Crystal Thin-Film Wafer

LIU Shanqun; DING Yuchong; CHEN Zheming; SHI Zibin; LONG Yong; ZOU Shaohong; YU Guiqiu; ZHANG Li

doi:10.11977/j.issn.1004-2474.2024.05.015

Journals >Piezoelectrics & Acoustooptics >Volume 46 >Issue 5 >Page 700 > Article

Piezoelectrics & Acoustooptics
Vol. 46, Issue 5, 700 (2024)

Bonding-Surface-Cleaning Technology for Preparing Piezoelectric Single-Crystal Thin-Film Wafer

LIU Shanqun, DING Yuchong, CHEN Zheming, SHI Zibin..., LONG Yong, ZOU Shaohong, YU Guiqiu and ZHANG Li|Show fewer author(s)

Author Affiliations

The 26th Institute of China Electronics Technology Group Corporation, Chongqing 400060, China

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DOI: 10.11977/j.issn.1004-2474.2024.05.015 Cite this Article

LIU Shanqun, DING Yuchong, CHEN Zheming, SHI Zibin, LONG Yong, ZOU Shaohong, YU Guiqiu, ZHANG Li. Bonding-Surface-Cleaning Technology for Preparing Piezoelectric Single-Crystal Thin-Film Wafer[J]. Piezoelectrics & Acoustooptics, 2024, 46(5): 700 Copy Citation Text

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References

[5] JIA Y C, WANG L, CHEN F. Ion-cut lithium niobate on insulator technology: recent advances and perspectives [J]. Applied Physics Reviews，2021, 8(1): 011307.

[7] LESTER M A. A glimpse into megasonic cleaning [J]. Semiconductor, 2003(9): 38.

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