Wang Haozhi, Guo Pengfeng, Wu Shuang, Tao Sha, Chen Wei, Zhao Xiaojie. Bottom-Up Drilling of Transparent Materials[J]. Chinese Journal of Lasers, 2020, 47(3): 302003
- Chinese Journal of Lasers
- Vol. 47, Issue 3, 302003 (2020)
Fig. 1. Schematic and photo of experimental setup. (a) Schematic; (b) photo
Fig. 2. Cut results of glass slide at different scan times with nanosecond green laser bottom-up processing. (a) 5 times; (b) 10 times; (c) 15 times; (d) 20 times; (e) 25 times; (f) 28 times, cut through
Fig. 3. Relationship between scan times and kerf depth
Fig. 4. Bottom-up drilling using green laser with pulse width of 12 ns. (a) Entrance; (b) exit
Fig. 5. Bottom-up drilling using green laser with pulse width of 2 ns. (a) Entrance; (b) exit
Fig. 6. Bottom-up drilling using picosecond infrared laser. (a) Entrance; (b) exit
Fig. 7. Bottom-up drilling using femtosecond green laser. (a) Entrance; (b) exit
Fig. 8. Relation between cutting efficiency or chipping length and pulse width for two cutting methods
Fig. 9. Relationship between ablation efficiency and pulse width when drilling in brittle materials using top-down method
Fig. 10. Chippings generated when glass is processed by picosecond and nanosecond laser with bottom-up method. (a) Picosecond laser; (b) nanosecond laser
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Table 1. Parameters of lasers used in experiment
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Table 2. Parameters of galvanometer and field lens
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