Laser direct writing technique has attracted much attention in the past years, as it can fabricate the conductive lines on insulator board directly without mask and with high precisions. However, the direct writing speeds are very low for the current techniques, which restrict its industrial applications greatly. In this paper, a new technology named laser micro-cladding technique is introduced, in which the metal-organic conductive pastes are used as the cladding materials, and the organic insulator resin boards are used as the substrate. The CO2 laser with the power of 0～20 W and the beam spot of 100 micron are used. The microstructure and the conductive properties as well as the bonding strength of the conductive lines with the substrate are studied. The results demonstrate that the conductive lines have excellent conductive properties and strong bonding strength with the substrate, which can satisfy the demands for industrial applications. Finally the mechanisms of the conductive line formation and conductivity are also analyzed.