
- Photonics Research
- Vol. 13, Issue 5, 1390 (2025)
Abstract
1. INTRODUCTION
Optical networks on chip (ONoCs) offer the advantages of large bandwidth and low latency in optical data transmission and are extensively utilized in artificial intelligence, high-speed communications, and optical sensing [1–3]. However, the development of ONoC is hindered by the scarcity of multi-spectral and multi-functional optical modulators [4,5]. Particularly, with the advent of fifth generation (5G) [6–8] and sixth generation (6G) [9–11] communications, the need for such modulators that cover both microwave and terahertz (THz) ranges has become a critical and challenging issue [5,12]. Metasurfaces enhance light-matter interactions within a minimal volume, serving as an essential tool for achieving precise and complex light field modulation in the absence of integrated functional optical devices [13,14]. Current metasurfaces, combined with optically controlled natural materials, can dynamically modulate the amplitude [15], frequency [16], phase [17], polarization [18], and wavefront [19] of electromagnetic waves, applied in dynamic notch filters, phase modulators, tunable perfect absorbers, polarization converters, and holography [20–24]. However, most studies on metasurfaces that cover both microwave and THz ranges can only dynamically control one spectrum, with the functionalities of the other remaining static, thus failing to achieve dual-frequency-range modulation [25,26]. To address the spectral broadening challenges introduced by 6G technology, further research is required on integrated optical elements capable of dynamically modulating functions across both microwave and THz ranges.
On the other hand, externally controlled light-sensitive functional materials are an indispensable part of all-optical modulators [27–29]. In the microwave range, functional materials of active modulators are generally light-responsive materials or components [30,31]. Components are usually photodiodes, varactors, and photoresistors [32]. The light-responsive materials are usually photosensitive materials such as silicon (Si) and graphene [33–35]. In the THz range, functional materials are generally light-responsive materials such as graphene [36], Si [37], perovskite, and vanadium dioxide (
In this paper, we introduce an innovative all-optical dual-frequency-range modulator, a first of its kind. This modulator integrates a planar nested multiscale metasurface with
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2. RESULTS AND DISCUSSION
A. Design and Characterization
The schematic diagram of the dual-frequency-range modulator is shown in Fig. 1(a). The modulator has four states. When there is no light pumped, both microwaves and THz waves are in the transmission state, allowing the transmission of information as depicted in Figs. 1(c) and 1(e). When only light1 is pumped, the modulator shields microwaves, as indicated in Fig. 1(b), while the THz wave is not transmitted, as shown in Fig. 1(e). When only light2 is pumped, the modulator allows microwave transmission and shields THz waves, as shown in Figs. 1(b) and 1(c). When light1 and light2 are pumped at the same time, the microwave and THz wave are shielded, as shown in Figs. 1(b) and 1(d).
Figure 1.Function diagram of dual-frequency-range modulator.
Figure 2 illustrates the structure diagram of the dual-frequency-range modulator. Figure 2(a) depicts the metal-only basic unit, labeled as structure S1, which forms the orange section of the larger structure, labeled as structure L, shown in Fig. 2(b). Figure 2(c) displays the small basic Si-hybrid structure, labeled as structure S2. Controlled by light1, conductivity of Si on structure S2 is modulable, influencing the overall structural performance and forming the blue section of structure L. The top is covered with a perovskite film to realize the THz band amplitude modulation function of the metasurface. The film’s conductivity can be modulated by light2, affecting the structure’s properties. The geometric parameters are
Figure 2.Structure diagram of dual-frequency-range modulator. (a) Structure S1 diagram. (b) Structure L diagram. (c) Structure S2 diagram. (d) The overall structure of the confocal microscope. (e) Local magnification of confocal microscope.
As depicted in Figs. 2(a) and 2(c), the two smaller basic units comprise four split-ring resonators (SRRs) and four metallic wires each. We use the Computer Simulation Technology (CST) Microwave Studio to obtain the simulation results and current distribution of the modulator to analyze the modulator modulation principle. In the THz range, structure S1 generates a transparent peak due to electromagnetically induced transparency (EIT) resonance. As shown in Fig. 3(a), when the THz wave in the
Figure 3.Simulation results of CRR and SRRs of structure S1 in THz range. (a) The THz transmittance of the SRRs structure changes with frequency. (b) The THz transmittance of the CRR structure changes with frequency. (c) The current distribution of the SRRs structure at 0.983 THz. (d) The current distribution of the CRR structure at 0.983 THz.
The total THz transmittance of structure S1 as a function of frequency is shown in Fig. 4(a). Under THz wave excitation, EIT resonance occurs in structure S1, creating a transmission window with a peak transmittance of 74.13% at 0.66 THz. The corresponding current distribution is depicted in Fig. 4(b). Compared to the current distributions of the SRRs and CRR individually, the overall current intensity in structure S1 increases. This is due to the SRRs’ bright mode generating a strong current, which induces a magnetic field that excites currents in both the quasi-dark and dark mode metal wires along the
Figure 4.Simulation results of structure S1 in THz range. (a) The THz transmittance of structure S1 changes with frequency. (b) The current distribution of structure S1 at 0.66 THz when the conductivity of
For structure S2, in the THz range, when the conductivity of Si is 0 S/m, the metal wires cannot form a CRR, and only the metal wire along the
Figure 5.Simulation results of structure S2 peripheral metal wire in THz range. (a) The THz transmittance of structure S2 peripheral metal wire changes with frequency when the conductivity of Si is 0 S/m. (b) The THz transmittance of structure S2 peripheral metal wire changes with frequency when the conductivity of Si is 50,000 S/m. (c) The current distribution of structure S2 peripheral metal wire at 0.80 THz when the conductivity of Si is 0 S/m. (d) The current distribution of structure S2 peripheral metal wire at 0.80 THz when the conductivity of Si is 50,000 S/m.
Figure 6.Simulation results of structure S2 in THz range. When the conductivity of Si is 0 S/m, (a) the THz transmittance of structure S2 changes with frequency; (b) the current distribution of structure S2 at 0.73 THz when the conductivity of
When the conductivity of Si is 50,000 S/m, the metal wires reconnect to form a CRR; the THz transmittance of the structure S2 peripheral metal wire changing with frequency is shown in Fig. 5(b), similar to the CRR in structure S1. The dark mode metal wire along the
In the microwave range, structure S2, with a period of 80 μm, does not resonate with the microwave, and the change of transmittance with frequency is basically a straight line. As the conductivity of Si increases, the transmittance gradually decreases by approximately 15%, as shown in Fig. 7(b). For structure S1, although its structural period is also 80 μm, its four metal strips form a CRR. The outer ring of the CRR has the same size as the structural period, and the metal strips of multiple small structures S1 are connected, forming a large metal grid. This can be approximated as a conductive film with poor conductivity, causing the reflection between the microwave and structure S1 to dominate, leading to an excellent shielding effect with a transmittance of only 0.02%, as shown in Fig. 7(c).
Figure 7.Simulation results of modulator in microwave band. (a) The curve of microwave transmittance of large structure L with frequency. (b) The curve of microwave transmittance of structure S2 with frequency. (c) The curve of microwave transmittance of structure S1 with frequency. (d) The current distribution of the structure L at 0.66 THz when the Si conductivity is 0 S/m. (e) The current distribution of structure S2 at 0.66 THz when the conductivity of Si is 50,000 S/m.
Structure S1 and structure S2 finally form a large structure L, where the center is the Jerusalem structure, and the edges are composed of CRR, with the outer ring of CRR matching the unit structure size, as shown in Fig. 2(b). When the conductivity of Si is 0 S/m, structure S1 primarily transmits microwaves, as shown in Fig. 2(b), while structure S2 serves as a shielding element. In the large structure L, the position of structure S2 can be approximated as a conductive film with low conductivity. The curve of microwave transmittance of large structure L with frequency is shown in Fig. 7(a). When the conductivity of Si is 0 S/m, the structure can generate a transmission peak with a transmittance of 51.27% at 9.92 GHz, induced by LC resonance. When the conductivity of Si is 800 S/m, the Si in structure S2 exhibits some conductive properties. Combined with the strong shielding effect of structure S1 on microwaves, the overall large structure can be approximated as a layer of conductive film with low conductivity, as shown in Fig. 7(a). Consequently, the final transmittance is reduced to only 5%. The current distribution of the metasurface for both cases is shown in Figs. 7(d) and 7(e). When the conductivity of Si is 0 and 800 S/m, the current directions in the middle and outer sections are opposite and remain unchanged with the variation of Si conductivity. The overall current intensity is small. This indicates that there is a weak EIT effect in this structure. However, the resonance peak and control effect are primarily governed by LC resonance rather than the EIT effect.
To validate our design, we fabricated samples on a commercial silicon-on-sapphire (SoS) chip. The SoS wafer is an epitaxial Si with a thickness of 700 nm grown on a
B. Results and Analysis in the Microwave Range
The test results of the all-optical dual-frequency-range modulator at 8–18 GHz using a microwave vector network analyzer are presented in Fig. 8. In the experiments, we employed 639 nm visible light (light1) and 1064 nm near-infrared light (light2) to pump the samples, with the results depicted in Figs. 8(a) and 8(b), respectively. When there is no pumped light, the sample forms an LC resonance at the microwave range, forming a transmission peak with a maximum transmittance of 55.52% at 10.05 GHz. As the intensity of light1 increases, the microwave transmittance progressively decreases, reaching a minimum of 3.31% at the highest light intensity, and the average transmittance is only 2.91%, showing a shielding state. According to the definition of transmittance modulation depth (MD)
Figure 8.Experimental results for the all-optical dual-frequency-range modulator operating within the 8–18 GHz range. (a) Transmittance curves for sample subjected to varying light intensities (light1) as a function of range. (b) Transmittance curves for sample subjected to varying intensities (light2) as a function of range.
C. Results and Analysis in the THz Range
The THz-TDS detection system was employed to test the all-optical dual-frequency-range modulator in the 0.1–1.1 THz range, as illustrated in Fig. 9. In the experiments, we utilized light1 and light2 to pump the samples, as depicted in Figs. 9(a) and 9(b), respectively. When there is no light pump, the interaction between the THz waves and the sample resulted in an energy exchange, producing a broadband transmission effect with transmittance exceeding 50% between 0.54 and 0.93 THz, peaking at 65.33%. As the intensity of light2 increased, the transmittance of the THz waves gradually decreased, culminating in a minimum transmittance of 10.62% at maximum light intensity, indicating a shielding state. Similarly, when pumped with maximum intensity light1, the sample exhibited a broadband transmission effect greater than 50% from 0.40 to 0.95 THz. This situation not only extended the transmission bandwidth but also increased the peak transmittance to 80.63%. However, an increase in light2 intensity again gradually reduced the THz wave transmittance, reaching a shielding state with only 7.44% transmittance at the highest intensity, corresponding to a modulation depth of 90.77%. It is basically consistent with simulation results of the modulator in THz range shown in Fig. 5 obtained by CST simulation, which proves the accuracy of the above analysis.
Figure 9.Experimental results for the all-optical dual-frequency-range modulator within the 0.10–1.10 THz range. (a) When the light2 intensity is 0 mW, the experimental curves of the transmittance of the sample with different intensities of light1 are changed with the range. (b) When the intensity of light2 is 1000 mW, the experimental curves of the transmittance of the samples pumped by different intensities of light1 varying with range are obtained.
D. Mechanism Analysis of Control Materials
To achieve dual-frequency-range modulation of microwave and THz ranges, two materials, Si and
Figure 10.All-optical material modulation mechanism. (a) Linear absorption process of Si. (b) Nonlinear absorption process of
E. Near-Field Distribution of All-Optical Dual-Frequency-Range Modulator
To understand the resonance mechanism of the structure, we studied the near-field distribution of the all-optical dual-frequency-range modulator as shown in Fig. 11. Figures 11(a)–11(d) depict the microwave near-field distribution at varying Si conductivities. As shown in Fig. 11(a), when the Si conductivity is 0 S/m, a strong electric field is generated at the interface between the Jerusalem structure and the metal frame. With increasing Si conductivity, the electric field intensity diminishes until it disappears, indicating that the microwave transmission peak results from LC resonance. As Si conductivity increases, the capacitance in the LC resonance state decreases, leading to the disappearance of the resonance and the transmission peak. Figures 11(e)–11(h) show the electric field distribution for structure S1 in the THz wave at varying
Figure 11.The near-field distribution of all-optical dual-frequency-range modulator. (a)–(d) The near-field distribution of microwave range under different conductivities of Si. (e)–(h) The near-field distribution of structure S1 in the THz wave range under different
F. Optical Range Transmittance
In addition to enabling the switching between multiple states in both microwave and THz ranges, the modulator also exhibits a certain optical transmittance. The transmission spectrum of the test sample in the 200–2500 nm range is shown in Fig. 12. The structure demonstrates optical transmittance visible to the naked eye, with an average transmittance of 54.74%. The optical transmission characteristics of the sample are attributed to the fact that the wavelength of the optical range is much smaller than the structural period, allowing light waves to pass through the sample. However, due to the high proportion of metal structure and the intrinsic light absorption of the
Figure 12.Transmittance of all-optical dual-frequency-range modulator in the optical range.
3. CONCLUSION
In summary, for the first time, we proposed and experimentally verified an all-optical dual-frequency-range modulator. The modulator is based on a planar nested multiscale metasurface combined with
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