Femtosecond laser additive and subtractive micro-processing: enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging

Gligor Djogo; Jianzhao Li; Stephen Ho; Moez Haque; Erden Ertorer; Jun Liu; Xiaolu Song; Jing Suo; Peter R Herman

doi:10.1088/2631-7990/ab4d51

Journals >International Journal of Extreme Manufacturing >Volume 1 >Issue 4 >Page 45002 > Article

International Journal of Extreme Manufacturing
Vol. 1, Issue 4, 45002 (2019)

Femtosecond laser additive and subtractive micro-processing: enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging

Gligor Djogo^1、*, Jianzhao Li¹, Stephen Ho¹, Moez Haque¹, Erden Ertorer¹, Jun Liu², Xiaolu Song², Jing Suo², and Peter R Herman¹

Author Affiliations

¹The Edward S Rogers Sr Department of Electrical & Computer Engineering, University of Toronto,Toronto, Canada

²Transmission & Access Research Department, Huawei Technologies Co., Ltd, Dongguan, People’s Republic of China

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DOI: 10.1088/2631-7990/ab4d51 Cite this Article

Gligor Djogo, Jianzhao Li, Stephen Ho, Moez Haque, Erden Ertorer, Jun Liu, Xiaolu Song, Jing Suo, Peter R Herman. Femtosecond laser additive and subtractive micro-processing: enabling a high-channeldensity silica interposer for multicore fibre to silicon-photonic packaging[J]. International Journal of Extreme Manufacturing, 2019, 1(4): 45002 Copy Citation Text

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