[3] PFRAHLER J N.Advances in Thermal Modeling of Electronic Components and Systems[M].New York:SME Press,1990.

[4] HUNT C E,DESMOND C A,CIARLO D R,et al..Direct bonding of micromachined silicon wafers for laser diode heat exchanger applications[J].J.Micromech.Microeng.,1991,(1):152-156.

[5] HARRISON J D,FLURI K,SELLER K,et al..Micromachining a miniaturized capillary electrophoresis-based chemical analysis system on a chip[J].Science,1993,261:895-897.

[7] LYKLEMA J.Fundamentals of Interface and Colloid Science[M].New York:Academic Press,1995.

[8] QU W L,MALA G M,LID Q.Pressure-driven water flows in trapezoidal silicon microchannels[J].Int.J.Heat Mass Transfer,2000,43:353-364.

[9] LID Q.Electro-viscous effects on pressure-driven liquid flow in microchannels[J].Coll.Surf.A:Physicochem.Eng.Aspects,2001,195:35-57.

[10] MALA G M,YANG CH,LID Q.Electrical double layer potential distribution in a rectangular microchannel[J].Coll.and Surf.A:Physicochem.Eng.Aspects,1998,135:109-116.

[12] GAD-EL-HAK M.The MEMS Handbook[M].New York:CRC Press,2002.

[13] HUNTER R J.Zeta Potential in Colloid Science,Principles and Applications[M].New York:Academic Press,1981.