[1] FU Min, WEN Shang-sheng, XIA Yun-yun, et al. Failure analysis of GaN-based light-emitting diode with hole vertical structure［J］. Acta Physica Sinica, 2017, 66(4): 048501.

[2] SHI Xiang-liu, XINH Yun-li, XIANG Long-yu, et al. A route for white LED package using luminescent low-temperature cofired ceramics［J］. Journal of Alloys and Compounds, 2016, 655: 203-207.

[3] BALAJI D, KAVIRASU K, DURAIRUJAN A, et al. Photoluminescence properties of novel Sm3+ and Dy3+ co-activated CsGd(WO4)2 phosphors［J］. Journal of Alloys and Compounds, 2015, 637: 350-360.

[4] LIU Xin, FANG Wen-xiao. Analysis on the failure modes and mechanisms of LED packaging［C］. 2012 International Conference on Electronic Packaging Technology & High Density Packaging, 2012: 1500-1502.

[5] FU Min, WEN Shang-sheng, CHEN Hao-wei, et al. LSD analysis based on multiple LED light quality ratio on growth of aloe［J］. Chinese Journal of Luminescence, 2016, 37(3): 366-371.

[6] MYUNG W, MIN K, YONGIL Ki, et al. Effect of Ag content on the reliability of LED package component with Sn-Bi-Ag solder［J］. Mater Electron, 2015, 26(11): 8707-8713.

[7] MOONHWAN C, DIGANTA D, VARDE P, et al. Light emitting diodes reliability review［J］. Microelectronics Reliability, 2012, 52(5): 762-782.

[8] ZOU Shui-ping, WU Bai-xi, WAN Zhen-ping, et al. Effect of current-temperature stress on the reliability of GaN LED［J］. Chinese Journal of Luminescence, 2016, 37(1): 124-129.

[9] XUE Zheng-qun, HUANG Sheng-rong, ZHANG Bao-ping, et al. Analysis of failure mechanism of GaN-based white light-emitting diode［J］. Acta Physica Sinica, 2010, 59(7): 5002-5009.

[10] XIE Qian-wen. LED packaging and reliability research［D］. Chengdu: University of Electronic Science and Technology of China, 2012.

[11] GAO Chuan-hua, JIANG Hao, HAN Zhi-yuan, et al. Preparation and properties of high performance and high refractive index silicone encapsulant for LED［J］. Silicon Material, 2016, 30(3): 207-211.

[12] ZHUANG Wei, WEN Jing, WEN Yu-mei, et al. Experimental research on the ideality factor of LED chips in packaging［J］. Journal of Optoelectronics.Laser, 2011, 22(9): 1290-1294.

[13] WU Qi-bao, QING Shuang-gui, XIONG Tao, et al. Current situation of high-power LED encapsulant［J］. Technology&Development of Chemical Industry, 2009, 38(2): 15-17.

[14] ZHANG Bao-tan, LI Ru, CHEN Xiu-ning, et al. Advanced progress of LED encapsulation materials［J］. New Chemical Materials, 2010, 38(4): 23-27.

[15] TSAO J Y. Solid-state lighting［J］. IEEE Circuits & Devices, 2004, 20(3): 28-37.

[16] XIAO Cheng-di, LIU Chun-jun, LIU Wei-dong, et al. Reliability assessment of LED lamp based on acceleration degradation test［J］. Chinese Journal of Luminescence, 2014, 35(9): 1143-1151.

[17] DONG Li, LIU Hua, WANG Yao, et al. Reliability of light source modeling for distribution design on compact LED［J］. Acta Photonica Sinica, 2014, 43(2): 0222003.

[18] MATTEO M, LORENZO T, GAUDENZIO M, et al. A review on the reliability of GaN-based LEDs［J］. IEEE Transactions on Device and Materials Reliability, 2008, 8(2): 323-331.

[19] MENEGHINI M, LORENZO T, ZEHNDER U, et al. High-temperature degradation of GaN LEDs related to passivation［J］. IEEE Transactions on Device and Materials Reliability, 2006 53(12): 2981-2987.

[20] GUO Chun-sheng, ZHANG Yan-feng, WAN Ning, et al. The investigation of LED degradation model based on the chemical kinetics［J］. Acta Physica Sinica, 2013, 62(21): 218503.

[21] ZHENG Zhi-bin. Impact of LED epoxy casting process on its reliability［J］. Reliability, 2012, 37(6): 479-488.

[22] WU Bu-long. Effect of environmental conditions and packaging process on reliability and uniformity of high power LED［D］. Wuhan: Huazhong University of Science and Technology, 2012.

[23] CHEN Hua, ZHOU Xing-lin, TANG Wen,et al. Thermal design of high power remote phosphor white LED package［J］. Chinese Journal of Luminescence, 2017, 38(1): 97-102.

[24] TAN C W, CHAN Y C, YEUNG N H. Effect of autoclave test on anisotropic conductive joints［J］. Microelectronics Reliability, 2003, 43(2): 279-285.