In order to explore the impact of Light Emitting Diode (LED) silicone package on the LED failure, the failure case of LED packaging glue is chosed to analyze the failure. Fourier transform infrared spectroscopy and gas chromatography mass spectrometry were used to analyze the composition of the failed samples. Finally, the failure mechanism of the samples was obtained based on the analysis results. The analysis results show that, the chemical incompatibility of the material in the LED lamp bead package sealing process leads to the failure of the sealing glue, and the LED lamp beads have a poor air tightness, which affects the light, electricity, heat, mechanical structure, and material properties. LED reliability is reduced; therefore, in the manufacturing process of LED, it is also necessary to avoid material incompatibility and increase the reliability of the LED.