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Journals >
Acta Photonica Sinica >
Volume 50 >
Issue 6 >
Page 66 > Article
Acta Photonica Sinica
Vol. 50, Issue 6, 66 (2021)
Water-assisted Femtosecond Laser Silicon Carbide Micro-hole Machining(Invited)
Sijia XU, Yanhao YU, and Qidai CHEN
Author Affiliations
State Key Laboratory of Integrated Optoelectronics, College of Electronic Science and Engineering,Jilin University, Changchun130012, China
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DOI:
10.3788/gzxb20215006.0650106
Cite this Article
Sijia XU, Yanhao YU, Qidai CHEN. Water-assisted Femtosecond Laser Silicon Carbide Micro-hole Machining(Invited)[J]. Acta Photonica Sinica, 2021, 50(6): 66
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Fig. 1.
Schematic of the experimental set up
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Fig. 2.
The SEM image and EDS analysis of micro-hole
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Fig. 3.
Depth and diameter of the hole versus pulse energy
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Fig. 4.
The SEM images and schematic diagram of micro-holes processed at different intial processing depths
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Abstract
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Figures&Tables (4)
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Sijia XU, Yanhao YU, Qidai CHEN. Water-assisted Femtosecond Laser Silicon Carbide Micro-hole Machining(Invited)[J]. Acta Photonica Sinica, 2021, 50(6): 66
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Paper Information
Category: Special Issue for Ultrafast Laser Precision Machining of Hard and Brittle Materials
Received: Apr. 15, 2021
Accepted: May. 20, 2021
Published Online: Jun. 25, 2021
The Author Email:
DOI:
10.3788/gzxb20215006.0650106
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