• Optics and Precision Engineering
  • Vol. 18, Issue 3, 653 (2010)
LIU Hui*, LIU Jun-yan, and WANG Yang
Author Affiliations
  • [in Chinese]
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    DOI: Cite this Article
    LIU Hui, LIU Jun-yan, WANG Yang. Detection of contacting interface-type defects using ultrasound lock-in thermography[J]. Optics and Precision Engineering, 2010, 18(3): 653 Copy Citation Text show less
    References

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    [3] MIGNOGNA R B, GREEN R E, DUKE J C, et al..Thermographic investigation of high-power ultrasonic heating in materials [J].Ultrasonics , 1981,19(4):159-163.

    [4] ZWESCHPER T H, DILLENZ A, RIEGERT G, et al..Ultrasound excited thermography using frequency modulated elastic waves[J].Insight: Non-Destructive Testing and Condition Monitoring, 2003,45(3):178-182.

    [5] DILLENZ A, ZWESCHPER TH, BUSSE G.Elastic wave burst thermography for NDE of subsurface features[J].Insight: Non-Destructive Testing and Condition Monitoring, 2000,12(42):815-817.

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    [7] GLEITER A, RIEGERT G, ZWESCHPER TH, et al..Ultrasound-Lockin-Thermography for Advanced depth resolved defect selective imaging[J].Insight: Non-Destructive Testing and Condition Monitoring,2007,5(49):272-274.

    [8] LI Y H, ZHAO Y J, FENG L C, et al..Measurement of defect depth by infrared thermal wave nondestructive evaluation based on pulsed phase[J].Opt.Precision Eng., 2008,16(1):55-58.(in Chinese)

    [9] BERGLIND H, DILLENZ A.Detecting glue deficiency in laminated wood—a thermography method comparison[J].NDT&E International, 2003,36(6):395-399.

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    [1] Tian Gan, Yang Zhengwei, Zhu Jietang, Zhang Wei, Luo Wenyuan. Vibration characteristics and acoustic chaos analysis of ultrasonic infrared thermal wave test[J]. Infrared and Laser Engineering, 2016, 45(3): 304003

    [2] DUN Yi, SHI Xiao-hong, WANG Guang-long, ZHOU Zhao-ying. Nonlinear ultrasonic test of micro-nano crack[J]. Optics and Precision Engineering, 2011, 19(1): 132

    LIU Hui, LIU Jun-yan, WANG Yang. Detection of contacting interface-type defects using ultrasound lock-in thermography[J]. Optics and Precision Engineering, 2010, 18(3): 653
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