[8] Bai W, Wong B S. Evaluation of defects in composite plate under connective environments using lock-in thermography[J]. Measurement Science and Technology, 2001, 12(2): 142-150.
[8] Bai W, Wong B S. Evaluation of defects in composite plate under connective environments using lock-in thermography[J]. Measurement Science and Technology, 2001, 12(2): 142-150.
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