In order to manufacture tungsten-copper complicate parts with high precision and densification, two different characterizations of tungsten powder balled with copper powder are manufactured by selective laser melting (SLM). The dimensional accuracy, surface morphology and microstructure of specimens are studied. The composite powder containing irregular tungsten powder with ₅₀=5 μm causes non-uniform rolling powder and serious sparks occur in sintering process. With the increasing of mass content of W from 60% to 75%, the height shrinkage increases from 70 μm to 220 μm, the length and width increase from 50 μm to 150 μm, from 70 μm to 150 μm, respectively. The surface morphology evolves from adhered debris to balling phenomenon, pores and W particle agglomerate exist in the microstructures. The composite powder containing regular tungsten powder with ₅₀=20 μm shows uniform rolling powder process and no sparks occur in sintering. With the increasing of mass content of W from 60% to 75%, the height shrinkage increases from 70 μm to 220 μm, the length and width increase from 20 μm to 50 μm, the surface morphology evolves from sound to slightly melt fracture and the particle rearrangement is obvious. The regular tungsten powder with ₅₀=20 μm is more applicable to manufacturing WCu components by selective laser melting than the irregular tungsten powder with ₅₀=5 μm.