[1] HAN Y Y, ZHANG Y M, HAN J C, et al.. Development of the silicon carbide mirror and system in the world ［J］. Material Engineering, 2005(6): 59-63.(in Chinese)

[2] ZHAO W X, ZHANG G, ZHAO R CH, et al.. Fabrication of silicon carbide lightweight mirror blank ［J］. Opt. Precision Eng., 2011, 19(11): 2609-2617.(in Chinese)

[3] IWONA A. Palusinski and isaac ghozeil ［J］. Developing SiC for Optical System Applications. SPIE, 2004, 5524: 14-20.

[4] XU L D, ZHENG L G, FAN D, et al.. IAD-Si modification on RB-SiC space mirror for super-polished surface ［J］. Opt. Precision Eng., 2008, 16(12): 2497-2502.(in Chinese)

[5] WANG X. Fabrication of SiC mirror in full aperture with optimized fixed abrasive polishing pad ［J］. Opt. Precision Eng., 2012, 20(10): 2123-2131.(in Chinese)

[6] SANJEEV K, CHOUDHURY S K. Prediction of wear and surface roughness in electro-discharge diamond grinding ［J］. Journal of Materials Processing Technology, 2007(191): 206-209.

[7] KOSHY P, JAIN V K, LAL G K. Mechanism of material removal in electrical discharge diamond grinding ［J］. Int. J. Mach. Tools Manufact, 1996, 36(10): 1173-1185.

[8] CHOUDHURY S K, JAIN V K, CUPTA M. Electrical discharge diamond grinding of high speed steel ［J］. Machining Scienceand Technology, 1999, 3(1): 91-105.

[9] SINGH G K, YADAVA V Y, KUNAR R. Multiresponse optimization of electro-discharge diamond face grinding process using robust design of experiments ［J］. Materials and Manufacturing Process, 2010, 25: 851-856.

[10] SHIH H R, SHU K M. A study of electrical discharge grinding using a rotary disk electrode ［J］. Int. J. Adv. Manuf. Technol., 2008, 38: 59-67.

[11] SHU K M, TU G C. Study of electrical discharge grinding using metal matrix composite electrodes ［J］. International Journal of Machine Tools & Manufacture, 2003, 43: 845-854.

[12] AGRAWAL S S, YADAVA V. Modeling and prediction of material removal rate and surface roughness in surface-electrical discharge diamond grinding process of metal matrix composites ［J］. Materials and Manufacturing Processes, 2013, 28: 381-389.

[13] YADAV R N, YADAVA V. Influence of input parameters on machining performances of slotted-electrical discharge abrasive grinding of Al/SiC/Gr metal matrix composite ［J］. Materials and Manufacturing Processes, 2013, 28: 1361-1369.

[14] LU Y H, YU L L, LI X P. Technology for electrical discharge grinding of non-conductive engineering ceramics ［J］. Chinese Journal of Mechanical Engineering, 2008, 44(8): 132-135.(in Chinese)

[15] GUO Y F, BAI J CH, LIU H SH, et al.. The study of the process of machining insulating ceramics by electrical discharge grilling ［J］. Electromachining & Mould, 2006, (1): 54-57.(in Chinese)

[16] BENEDICT G F. Nontraditional Manufacturing Processes ［M］. New York: Marcel Dekker, 1987: 247-254.

[17] THOE T B, ASPINWALL D K, WISE M L H, et al.. Polycrystalline diamond edge quality and surface integrity following electrical discharge grinding ［J］. Journal of Materials Processing Technology, 1996, 56: 773-785.

[18] REN G X. Study on Electrical Discharge Grinding of Nickel-based Superalloy ［D］. Shenyang: Northeastern University, 2012.(in Chinese)

[19] LIEW P J, SHIMADA K, MIZUTANI M, et al.. Fabrication of microstructures on RB-SiC by ultrasonic cavitation assisted micro-electrical discharge machining［J］. International Journal of Automation Technology, 2013, 7(6): 621-629.

[20] YAO W, ZHANG Y M, HAN J C, et al.. Grinding characteristics of reaction bonded silicon carbide ［J］. Journal of Inorganic Materials, 2012, 27(7): 764-768.(in Chinese)