• Opto-Electronic Engineering
  • Vol. 50, Issue 7, 230136 (2023)
Haijun Zheng1, Bin Ge1、*, Chenxing Xia1、2, and Cheng Wu1
Author Affiliations
  • 1College of Computer Science and Engineering, Anhui University of Science and Technology, Huainan, Anhui 232001, China
  • 2Institute of Energy, Hefei Comprehensive National Science Center, Hefei, Anhui 230031, China
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    DOI: 10.12086/oee.2023.230136 Cite this Article
    Haijun Zheng, Bin Ge, Chenxing Xia, Cheng Wu. Infrared-visible person re-identification based on multi feature aggregation[J]. Opto-Electronic Engineering, 2023, 50(7): 230136 Copy Citation Text show less

    Abstract

    Infrared-visible person re-identification has been widely used in video surveillance, intelligent transportation, security, and other fields. However, due to the differences between different image modalities, it brings great challenges to this field. The existing methods mainly focus on mitigating the differences between modes to obtain more discriminating features, but ignore the relationship between adjacent features and the influence of multi-scale information on global features. Here, a infrared-visible person re-identification method (MFANet) based on multi-feature aggregation is proposed to solve the shortcomings of existing methods. Firstly, the adjacent level features are fused in the feature extraction stage, and the integration of low-level feature information is guided to strengthen the high-level features and make the features more robust. Then, the multi-scale features of different receptive fields of view are aggregated to obtain rich contextual information. Finally, multi-scale features are used as a guide to strengthen the features to obtain more discriminating features. Experimental results on SYSU-MM01 and RegDB datasets show the effectiveness of the proposed method, and the average accuracy of SYSU-MM01 dataset reaches 71.77% in the most difficult all-search single-shot mode.
    Haijun Zheng, Bin Ge, Chenxing Xia, Cheng Wu. Infrared-visible person re-identification based on multi feature aggregation[J]. Opto-Electronic Engineering, 2023, 50(7): 230136
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