Fig. 1. Schematic diagram of the PIC
Fig. 2. Crosstalk between adjacent optical waveguides
Fig. 3. Loss of bent waveguide
Fig. 4. 1×16 AWG simulation results
Fig. 5. Temperature distribution of phase modulator simulation model
Fig. 6. Time response for π phase shift
Fig. 7. The relationship between the thickness of the upper cladding layer and the metal absorption loss
Fig. 8. Improved MMI simulation results
Fig. 9. Results of multi-layer waveguide
Fig. 10. Layout of photonic integrated chip
Fig. 11. Schematic of Si waveguides
Fig. 12. Bending loss of Si3N4 waveguide
Fig. 13. Structural diagram of the interlayer transition of waveguides
Fig. 14. Overall layout of photonic integrated chip
Fig. 15. interference baselines on different Lens Pairs
Fig. 16. Schematic of focal plane and multi-waveguides
Fig. 17. Schematic diagram of three-dimensional simulation of electronic prototype
Design parameter | Symbol | Value |
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Center wavelength | λ0 | 1.56 μm | Index of planar waveguide | ns | 2.84 | Index of rectangular waveguide | nc | 2.48 | Number of arms | M | 60 | Free spectral region | FSR | 51.2 nm | Grating order | m | 30 | Number of input/output waveguides | N | 1×16 | Channel spacing | d | 3.2 nm |
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Table 1. Design parameter table of 1×3AWG
Design parameter | Symbol | Value |
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Longest baseline | Bmax | 30.4 mm | Wavelength | λ | 1.53~1.59 μm | Diameter of microlens | d | 1 mm | Number of microlenses | K | 16 | Field of view | θ | 0.5 ° | Focal length | f | 1 mm |
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Table 2. Microlens interference baseline design index
Design parameter | Symbol | Value |
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PIC cards | Nz | 41 | Prototype caliber | Φ | 110 mm | Wavelength | λ | 1.53~1.59 μm | Field of view | θ | 0.5 ° | Observation distance | Z | 100 km | Spatial resolution | δ0 | 5 m | Angular resolution | δ1 | 0.05 mrad | Diameter of microlens | d | 1 mm | Spectral number | Nq | 16(Δλ=3.2 nm) |
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Table 3. Design parameters of the simulation electronic prototype