Yibo ZHANG, Xinxin KONG, Sizepeng ZHAO, Jingang JIA, Dehuai JIANG, Jiahui SONG, Zhou WU. Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection[J]. Optics and Precision Engineering, 2024, 32(15): 2418
- Optics and Precision Engineering
- Vol. 32, Issue 15, 2418 (2024)
Fig. 1. Principle for wafer geometry measurement
Fig. 2. Wafer deformation at various tilt angles
Fig. 3. Parametric model of wafer vertical clamping
Fig. 4. Sensitivity analysis of thickness direction deviation in three-point and four-point clampings
Fig. 5. Illustration of vertical wafer clamping constraints
Fig. 6. Illustration of vertical wafer clamping structure and interconnection
Fig. 7. Analysis of fixed edge support positions
Fig. 8. Correlation between fixed support location slope angle deviation and additional warpage
Fig. 9. Correlation between clamping force and additional warpage
Fig. 10. Correlation between adjustable edge support position deviation and additional warpage
Fig. 11. Clamping reproducibility testing
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Table 1. Wafer geometry and material properties
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Table 2. Design parameter requirements for vertical wafer clamping
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