• Optics and Precision Engineering
  • Vol. 19, Issue 7, 1612 (2011)
ZOU Wen-dong1,*, HUANG Chang-hui1, ZHENG Qiang2, XU Zhou-jue2, and DONG Na2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/ope.20111907.1612 Cite this Article
    ZOU Wen-dong, HUANG Chang-hui, ZHENG Qiang, XU Zhou-jue, DONG Na. Measurement of microscopic surface topography of alloy dimple fracture by scanning white-light interferometry[J]. Optics and Precision Engineering, 2011, 19(7): 1612 Copy Citation Text show less

    Abstract

    Scanning White-light Interferometry (SWLI) was proposed to measure the complex microscopic surface topography of a dimple fracture of 30CrMnSiA alloy. The Linnik structure was adopted in the system and the 3D image of the dimple fracture was rebuilt by the cosine Fourier analysis algorithm. Experiments show that the longitudinal measuring accuracy is better than 5 nm for a scan range of 120 μm. The cosine Fourier analysis offers strong abilities of phase extraction and noise suppression, and an ideal 3D reconstruction image of the dimple fracture is obtained. The obtained surface data were tested for fractal dimension by a slit island method. At incised height from 40% to 70%, the fractal dimension values range from 1.630 4 to 1.643 2 with an average of 1.641 7 and the standard deviation of 0.012 0, which indicates that the dimple fracture of 30CrMnSiA has a typical fractal character. In conclusion, the SWLI is an effective way to measure the microscopic 3-D fracture surface topography, and it is characterized by high longitudinal precision, long dynamic measuring range and high reconstruction efficiency.
    ZOU Wen-dong, HUANG Chang-hui, ZHENG Qiang, XU Zhou-jue, DONG Na. Measurement of microscopic surface topography of alloy dimple fracture by scanning white-light interferometry[J]. Optics and Precision Engineering, 2011, 19(7): 1612
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