• Acta Physica Sinica
  • Vol. 68, Issue 20, 200201-1 (2019)
Han-Ling Li and Bing-Yang Cao*
DOI: 10.7498/aps.68.20190923 Cite this Article
Han-Ling Li, Bing-Yang Cao. Topology optimization of the volume-to-point heat conduction problem at micro- and nano-scale[J]. Acta Physica Sinica, 2019, 68(20): 200201-1 Copy Citation Text show less
The schematic diagram of the VP problem.体点导热问题示意图
Fig. 1. The schematic diagram of the VP problem.体点导热问题示意图
The flow chart of topology optimization for the VP problem.体点导热拓扑优化的流程图
Fig. 2. The flow chart of topology optimization for the VP problem.体点导热拓扑优化的流程图
The effect of interpolation ways on the material distributions and temperature distributions in diffusive heat conduction: (a) Interpolating k; (b) interpolating .扩散导热下不同插值方式对材料分布和温度分布的影响 (a)插值k; (b)插值
Fig. 3. The effect of interpolation ways on the material distributions and temperature distributions in diffusive heat conduction: (a) Interpolating k; (b) interpolating . 扩散导热下不同插值方式对材料分布和温度分布的影响 (a)插值k; (b)插值
The material distributions obtained by topology optimization in diffusive heat conduction varying with and n.扩散导热下拓扑优化得到的材料分布随和n的变化
Fig. 4. The material distributions obtained by topology optimization in diffusive heat conduction varying with and n. 扩散导热下拓扑优化得到的材料分布随 和n的变化
The topology optimization obtained material distributions and temperature distributions varying with Kn in ballistic-diffusive heat conduction: (a) Kn = 0.002; (b) Kn = 0.01; (c) Kn = 0.1.弹道-扩散导热下拓扑优化的材料分布和温度云图随的变化 (a) Kn = 0.002; (b) Kn = 0.01; (c) Kn = 0.1
Fig. 5. The topology optimization obtained material distributions and temperature distributions varying with Kn in ballistic-diffusive heat conduction: (a) Kn = 0.002; (b) Kn = 0.01; (c) Kn = 0.1. 弹道-扩散导热下拓扑优化的材料分布和温度云图随 的变化 (a) Kn = 0.002; (b) Kn = 0.01; (c) Kn = 0.1
The temperature distribution for the material distribution obtained by topology optimization which interpolates in diffusive heat conduction at .扩散导热下插值的拓扑优化所得的材料分布在时的温度分布
Fig. 6. The temperature distribution for the material distribution obtained by topology optimization which interpolates in diffusive heat conduction at . 扩散导热下插值 的拓扑优化所得的材料分布在 时的温度分布
Kn$T_{{\rm{ave}}}^*$(括号内数据为 $T_{{\rm{ave}}}^*/T_{{\rm{ave}},{\rm{uni}}}^*$)
均匀分布 分布1 分布2 分布3 分布4 分布5
注: 分布1和2分别是扩散导热条件下插值k的拓扑优化结果、插值 ${k^{ - 1}}$的拓扑优化结果, 分布3—5分别是弹道-扩散导热条件下 $Kn$为0.002, 0.01, 0.1时的拓扑优化结果.
0.0020.98(100.0%)0.33 (33.7%)0.21 (21.4%)0.11 (11.2%)0.12 (12.2%)0.21 (21.4%)
0.011.07(100.0%)0.57 (53.2%)0.41(38.3%)0.30 (28.0%)0.29 (27.1%)0.33 (30.8%)
0.12.29(100.0%)1.97 (86.0%)1.84 (80.3%)1.64 (71.6%)1.62 (70.7%)1.60 (69.9%)
Table 1.

The average dimensionless temperature of different material distributions at different Knudsen numbers.

不同材料分布在不同努森数下对应的无量纲温度平均值

Han-Ling Li, Bing-Yang Cao. Topology optimization of the volume-to-point heat conduction problem at micro- and nano-scale[J]. Acta Physica Sinica, 2019, 68(20): 200201-1
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